Non-Contact Temperature Setting System for VLSI with High Heat Dissipation

Abstract

It was required to develop a non-contact cooling system for conducting radiation research of VLSI with high heat generation. During the development process, various available methods for cooling products were considered and tested: immersion cooling and a cold-box – these methods did not bring the desired result.As a result, a cooling system was assembled based on the process of blowing the VLSI crystal with high-pressure compressed air. The system was based on an air compressor. The compressor was supplemented with external sensors to control the temperature of the samples and a control system for the output air flow. The entire process of setting the sample temperature was automatically controlled from a personal computer. The software and hardware parts of the solution are presented in this article.This non-contact cooling system has shown itself well in the conditions of real VLSI radiation research at physical facilities. However, in the future it is planned to improve a number of parameters in order to develop this cooling system to increase its efficiency.