Mechanical testing of PCB using computer simulations

B. Psota, A. Otáhal, I. Szendiuch
{"title":"Mechanical testing of PCB using computer simulations","authors":"B. Psota, A. Otáhal, I. Szendiuch","doi":"10.1109/ISSE.2014.6887610","DOIUrl":null,"url":null,"abstract":"This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887610","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.
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利用计算机模拟对PCB进行力学测试
本文讨论了利用计算机仿真技术对PCB板进行力学测试,以获得机械可靠性的最佳配置。主要目标是确定在这种分析中起最重要作用的因素。为此目的进行了敏感分析,并定义了以下关键数据。关键的一步是确定正确的材料数据以及板的属性,包括其附件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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