C. McClellan, C. Bailey, I. Datye, A. Gabourie, R. Grady, K. Schauble, S. Vaziri, E. Pop
{"title":"3D Heterogeneous Integration with 2D Materials","authors":"C. McClellan, C. Bailey, I. Datye, A. Gabourie, R. Grady, K. Schauble, S. Vaziri, E. Pop","doi":"10.23919/SNW.2019.8782932","DOIUrl":null,"url":null,"abstract":"As traditional device scaling slows down, three-dimensional (3D) integrated circuits (ICs) are needed to continue Moore’s Law advancements. We show that two-dimensional (2D) semiconductors are promising for heterogeneously integrated 3D ICs owing to their atomically thin nature and unique processing, thermal, and device capabilities.","PeriodicalId":170513,"journal":{"name":"2019 Silicon Nanoelectronics Workshop (SNW)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Silicon Nanoelectronics Workshop (SNW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/SNW.2019.8782932","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
As traditional device scaling slows down, three-dimensional (3D) integrated circuits (ICs) are needed to continue Moore’s Law advancements. We show that two-dimensional (2D) semiconductors are promising for heterogeneously integrated 3D ICs owing to their atomically thin nature and unique processing, thermal, and device capabilities.
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