{"title":"EOS/ESD Manufacturing Mitigation Review","authors":"L. H. Koh, Bernard Chin, K. Y. Loh","doi":"10.23919/IEDS48938.2021.9468868","DOIUrl":null,"url":null,"abstract":"This paper serves to review the typical EOS/ESD manufacturing issues from component level to system level for ESD sensitive devices (ESDS). The automated testing handling equipment impact on ESDS component failure will be articulated. ESDS failure on printed circuit board assembly is included too.","PeriodicalId":174954,"journal":{"name":"2020 International EOS/ESD Symposium on Design and System (IEDS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International EOS/ESD Symposium on Design and System (IEDS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/IEDS48938.2021.9468868","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper serves to review the typical EOS/ESD manufacturing issues from component level to system level for ESD sensitive devices (ESDS). The automated testing handling equipment impact on ESDS component failure will be articulated. ESDS failure on printed circuit board assembly is included too.
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