7-Bit/2Cell (X3.5), 9-Bit/2Cell (X4.5) NAND Flash Memory: Half Bit technology

N. Shibata, H. Uchikawa, Taira Shibuya, Kenri Nakai, K. Yanagidaira, H. Inoue
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Abstract

In this work, a 3. 5bit/cell (X3.5) flash memory is introduced to achieve a lower giga-byte cost with high reliability and performance. Accordingly, 7-bit data are stored in two memory cells with 12-level Vth distributions. The X3.5 Programming method does not require the complex approach used in QLC and can easily be handled by NAND controller. QLC needs a more powerful ECC than TLC; hence, increasing the size of the ECC parity for QLC enlarges the die size. However, the same ECC parity size as TLC can be applicable to X3.5. An X3.5 die size with a TLC ECC is only 6.3% bigger than QLC. By contrast, X3.5 Program performance is 2.3 times faster than QLC with the QLC reliability criteria, which is relaxed from the TLC reliability criteria. If the size of the ECC parity is reduced to that of 32nmMLC, X3.5 die size will be close to that of QLC, while X3.5 Program performance will be 1.6 times faster than that of QLC. Moreover, X3.5 will meet the TLC reliability criteria. In addition to expanding X3.5 technologies, 4.5 bit/cell (X4.5) with a 24-level Vth distributions is also possible, which is suitable for cold storage applications.
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7-Bit/2Cell (X3.5), 9-Bit/2Cell (X4.5) NAND闪存:半比特技术
在这项工作中,一个3。引入5bit/cell (X3.5)闪存,以实现更低的千兆字节成本,同时具有高可靠性和高性能。因此,7位数据存储在两个具有12级Vth分布的存储单元中。X3.5编程方法不需要QLC中使用的复杂方法,可以很容易地由NAND控制器处理。QLC需要比TLC更强大的ECC;因此,增加QLC的ECC奇偶校验尺寸会扩大芯片尺寸。但是,与TLC相同的ECC奇偶校验大小可以适用于X3.5。带有TLC ECC的X3.5芯片尺寸仅比QLC大6.3%。相比之下,X3.5程序的性能比采用TLC可靠性标准的QLC快2.3倍。如果将ECC奇偶校验的尺寸减小到32nmMLC, X3.5的芯片尺寸将接近QLC,而X3.5的程序性能将比QLC快1.6倍。此外,X3.5将满足TLC可靠性标准。除了扩展X3.5技术外,还可以使用24级Vth分布的4.5位/单元(X4.5),这适用于冷库应用。
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