Novel PCB fabrication process roughness free for high frequency applications.

Perez-Fajardo Abel, Torres-Jacome Alfonso, Torres-Torres Reydezel
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引用次数: 2

Abstract

In this work, a new process for Print Circuit Board (PCB) fabrication is introduced. It is so far one of the lowest losses PCB fabrication process, for high frequency operation. Instead of a rigged surface for adhesion of the metal, a plasma process is used on homogeneous and polished surface of Teflon as substrate. For demonstrating the capability of this proposal, a microstrip is built and resulted with attenuation of a 2 Np/m at 20 GHz, loses were obtained from measurements from S-parameters.
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新颖的PCB制造工艺无粗糙度,适用于高频应用。
本文介绍了一种新的印刷电路板(PCB)制造工艺。它是迄今为止损耗最低的PCB制造工艺之一,适用于高频操作。采用等离子体工艺处理均匀且抛光的聚四氟乙烯表面作为衬底,而不是采用操纵表面来粘附金属。为了证明该提议的能力,构建了一个微带,并在20 GHz时产生了2 Np/m的衰减,损耗从s参数的测量中得到。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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