Integration and Packaging of UWB GaN Power Amplifier for Advanced Industrial Applications

Abstract

Emerging industrial applications, including 5G/beyond wireless devices, require high-power CW amplifiers with ultrawide bandwidth within a compact size and with high-performance reliability and repeatability. Moreover, for a wideband GaN HPA overcoming inherent limitations, withstanding high output mismatch and efficient thermal management raise many integration/packaging challenges. This paper provides the practical design, integration and packaging difficulties with industrial solutions, together with advanced packaging technologies, efficient selection of integration process, thermal interfacing and die-attach materials and heat spreaders. Finally, presents the development of compact high power GaN PAs with wider than decade bandwidth and CW P1dB power of more than 1 kW.