Modeling of Lateral Migration Mechanism of Holes in 3D NAND Flash Memory Charge Trap Layer during Retention Operation

Jaeyeol Park, Hyungcheol Shin
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引用次数: 3

Abstract

In this paper, we analyzed lateral migration mechanism of holes (LM) in 3D NAND Flash memory during retention operation. Retention characteristics were investigated using Technology Computer-Aided Design (TCAD) simulation and modeled using Weibull cumulative distribution function (WCD). Time-constant $(\tau)$ at various temperatures were extracted through the modeled equation. Finally, the activation energy (Ea) of LM was extracted by applying to the Arrhenius equation.
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三维NAND闪存电荷阱层中孔在保留过程中横向迁移机制的建模
本文分析了三维NAND闪存在保留操作过程中空穴(LM)的横向迁移机制。采用技术计算机辅助设计(TCAD)仿真研究了保留特性,并采用威布尔累积分布函数(WCD)建模。通过模型方程提取了不同温度下的时间常数$(\tau)$。最后,应用Arrhenius方程提取了LM的活化能。
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