Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. Pub Date : 2005-03-15 DOI:10.1109/AGEC.2005.1452343

Chen Hongtao, Wang Chunqing, Li Mingyua

{"title":"Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly","authors":"Chen Hongtao, Wang Chunqing, Li Mingyua","doi":"10.1109/AGEC.2005.1452343","DOIUrl":null,"url":null,"abstract":"Solder joint reliability in hard disk drive head assemblies is of great concern due to the increasing demand and popularity of portable electronic products such as mobile hard disk and laptop computers. The mechanical shock resulting from mishandling during transportation or customer usage may seriously affect the solder joint reliability and lead to malfunction of the electronic product eventually. However, little information in detail related to the dynamic responses of the hard disk drive (HDD) cover and suspension, which is closely related with the stress and strain in the solder joints during the mechanical shock, has been reported. In this paper, comprehensive dynamic response of the suspension and the corresponding distribution of stress and strain of the solder joints during the impact process are captured, and it is found that the solder joint failures mainly concentrate at the interface between solder and suspension. The failure mode and location of solder joints simulated by modeling is in good agreement with the mechanical shock experiment.","PeriodicalId":405792,"journal":{"name":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AGEC.2005.1452343","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

Abstract

Solder joint reliability in hard disk drive head assemblies is of great concern due to the increasing demand and popularity of portable electronic products such as mobile hard disk and laptop computers. The mechanical shock resulting from mishandling during transportation or customer usage may seriously affect the solder joint reliability and lead to malfunction of the electronic product eventually. However, little information in detail related to the dynamic responses of the hard disk drive (HDD) cover and suspension, which is closely related with the stress and strain in the solder joints during the mechanical shock, has been reported. In this paper, comprehensive dynamic response of the suspension and the corresponding distribution of stress and strain of the solder joints during the impact process are captured, and it is found that the solder joint failures mainly concentrate at the interface between solder and suspension. The failure mode and location of solder joints simulated by modeling is in good agreement with the mechanical shock experiment.

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硬盘磁头组件无铅焊点机械冲击建模与试验

由于移动硬盘和笔记本电脑等便携式电子产品的需求不断增加和普及，硬盘驱动器磁头组件的焊点可靠性受到极大关注。在运输或用户使用过程中，由于操作不当而产生的机械冲击可能会严重影响焊点的可靠性，最终导致电子产品的故障。然而，关于硬盘驱动器(HDD)外壳和悬挂的动态响应的详细信息很少，这与机械冲击过程中焊点的应力和应变密切相关。本文捕获了悬浮体在冲击过程中的综合动态响应和相应的焊点应力应变分布，发现焊点失效主要集中在焊点与悬浮体的交界面。模型模拟的焊点破坏模式和位置与机械冲击实验结果吻合较好。

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Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.

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