{"title":"Glass reflow process and its applications","authors":"N. Toan, S. Sangu, T. Ono","doi":"10.1109/NEMS.2016.7758246","DOIUrl":null,"url":null,"abstract":"This work presents the glass reflow process for microsystems. In this process, glass compounded silicon structures are achieved with the help of vacuum cavities under a high temperature. Three applications employing the glass reflow process, through-wafer interconnects, thermal isolation, and optical window, have been proposed and investigated.","PeriodicalId":150449,"journal":{"name":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2016.7758246","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This work presents the glass reflow process for microsystems. In this process, glass compounded silicon structures are achieved with the help of vacuum cavities under a high temperature. Three applications employing the glass reflow process, through-wafer interconnects, thermal isolation, and optical window, have been proposed and investigated.
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