S. Hwang, S. Hong, Sang Won Park, Jee-Young Yoon, M. Sung
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引用次数: 0
Abstract
CMOS Read-Out IC (ROIC) for the micro Bolometer type Infrared Sensor is to estimate voltage or current when resistance in bolometer sensor varies as infrared light radiates. Implemented ROIC patterns cannot be exactly same with LAYOUT pattern CMOS Read-out IC process. Also each bolometer pixel resistance is variable by process variation in uncooled Infrared Sensor process. Bolometer sensor is not only heated by the incident IR, but also by current flowing through it, which generates the bias-heating noise. In this paper, we present CMOS Read-out IC which used a fully differential input stage to reduce process variation and bias heating noise problems. We designed and fabricated a prototype readout integrated circuit intended for uncooled bolometer infrared focal plane array. The design is demonstrated by the fabrication of a prototype consisting of an array of 32 x 32 pixels. The prototypes are fabricated in 0.25μm CMOS process.
微辐射热计型红外传感器的CMOS读出IC (ROIC)是当辐射热计传感器中的电阻随红外光辐射而变化时,估计电压或电流。实现的ROIC模式不能与布局模式CMOS读出IC工艺完全相同。在非制冷红外传感器过程中,每个热计像素电阻随工艺变化而变化。测热计传感器不仅受到入射红外线的加热,而且受到流过它的电流的加热,从而产生偏热噪声。在本文中,我们提出了CMOS读出集成电路,它使用全差分输入级来减少工艺变化和偏置加热噪声问题。设计并制作了一种用于非制冷热计红外焦平面阵列的读出集成电路原型。通过制造一个由32 x 32像素阵列组成的原型来证明该设计。原型机采用0.25μm CMOS工艺制造。