The application of silicon-on-silicon MCMs to advanced analog power controllers

D. Dromgoole, Ahmad Lotfi, A. Feygenson, R. Frye, B. J. Han, K. Tai
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引用次数: 4

Abstract

A mixed signal power controller is implemented in a silicon-on-silicon MCM. The application is space limited, in which a discrete component implementation is physically large and costly. A large number of passive components (resistors and capacitors) are integrated into a silicon substrate with flip-chip analog ICs. Operational characteristics of the controller are verified after integration and are compared to the discrete version. High voltage isolation requirements and interference and noise issues are studied to determine the most critical portions of the MCM layout and design.
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硅对硅mcm在高级模拟功率控制器中的应用
混合信号功率控制器在硅对硅MCM中实现。该应用程序空间有限,其中离散组件实现在物理上很大且成本很高。大量的无源元件(电阻器和电容器)被集成到一个硅衬底与倒装模拟ic。对集成后控制器的工作特性进行了验证,并与离散版本进行了比较。研究了高压隔离要求以及干扰和噪声问题,以确定MCM布局和设计的最关键部分。
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Mixed signal digital sub-band tuner multichip module Thermal performance characteristic comparison between flip-chip wirebond ceramic multichip modules Space-cube: a flexible computer architecture based on stacked modules The application of silicon-on-silicon MCMs to advanced analog power controllers An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements
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