Fracture mechanical analysis of cracks in polymer encapsulated metal structures

O. Wittler, P. Sprafke, J. Auersperg, B. Michel, H. Reichl
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引用次数: 7

Abstract

Cracks inside polymeric packaging materials, which are used for protection and isolation of electronic components, can lead to failure of the whole system. In this presentation, the loading situation of cracks inside the polymer of encapsulated metal structures is analysed. The analysis is based on finite element simulations of thermally induced stresses. In a first approach, a linear elastic material model is assumed in combination with the application of linear elastic fracture concepts. The load of the crack is shown to be influenced by geometrical factors like its own initial form and length. Moreover, the occurrence of delamination in the interface between the metal and polymer can be very important, as it severely influences the crack front inside the polymer. The results of this analysis are compared to experimental observations and show good correlation. It is shown how the model can be improved by the application of a viscoelastic material model for the encapsulation material.
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聚合物包覆金属结构裂纹断裂力学分析
用于保护和隔离电子元件的聚合物封装材料内部的裂纹可能导致整个系统的故障。本文分析了包覆金属结构聚合物内部裂纹的加载情况。分析是基于热诱发应力的有限元模拟。在第一种方法中,结合线弹性断裂概念的应用,假设了一个线弹性材料模型。结果表明,裂纹的载荷受其初始形状和长度等几何因素的影响。此外,在金属和聚合物之间的界面上发生分层是非常重要的,因为它严重影响了聚合物内部的裂纹前沿。分析结果与实验结果进行了比较,显示出良好的相关性。通过将粘弹性材料模型应用于包封材料,说明了该模型的改进。
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