Impact of the Ball Grid Array Connection Failures on Signal Integrity

2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM) Pub Date : 2020-09-30 DOI:10.1109/HLM49214.2020.9307912

Kaixuan Song, Jinchun Gao, G. Flowers, Ziren Wang, Qingya Li, W. Yi

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引用次数: 4

Abstract

Ball grid arrays (BGA) are widely used in micro assemblies to provide both the mechanical connection between the chip substrate and the circuit board, and the electrical connection between the chip circuit and the peripheral matching circuit. Connection failures of a ball grid array may result in deterioration of signal integrity and low communication quality. In the present work, the impact of a degraded ball grid array connection on high-frequency characteristics was studied. A 3-D electromagnetic field model and an equivalent circuit model of a degraded ball grid array were developed. The electrical performance of the degraded ball grid array was analyzed and simulated. It was found that the 3-D electromagnetic field model results were in good agreements with the predicted behaviors from equivalent circuit model simulations. The characteristics of the ball grid array for different degradation levels were then compared and analyzed. This research serves to provide a better understanding of the effects of ball grid array deterioration on signal performance for application in fault detection strategies for electronic systems.

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球栅阵列连接故障对信号完整性的影响

球栅阵列(BGA)广泛应用于微组件中，既提供芯片衬底与电路板之间的机械连接，又提供芯片电路与外围匹配电路之间的电气连接。球栅阵列连接故障会导致信号完整性下降，通信质量下降。本文研究了退化球栅阵列连接对高频特性的影响。建立了退化球栅阵列的三维电磁场模型和等效电路模型。对退化球栅阵列的电性能进行了分析和仿真。结果表明，三维电磁场模型计算结果与等效电路模型仿真结果吻合较好。对比分析了不同退化程度下球栅阵列的特性。本研究有助于更好地理解球栅阵列退化对信号性能的影响，为电子系统故障检测策略的应用提供依据。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)

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