Reliability Analysis for High-Density PCA After Multiple BGA Reworks

Abstract

In ATE industry one high-speed, high-density PCA usually integrates multiple BGA packaged IC components. Reworking BGA components is a complicated process that also impacts PCA reliability. Therefore, the BGA rework limit in production is always a trade-off between the expensive costs of high-density PCAs and the reliabilities of PCAs after reworks. Most industries limit the BGA reworks to 3. In this work, we propose intensive 18 BGA reworks on single PCA, investigate thermal reflow effects on high aspect ratio PTH and micro-vias, and analyze solder joint qualities after reworks. The successful test results from cross-section and dye-and-pry demonstrate the reliabilities of such multiple BGA reworks on single high-density PCA.