Two 0.8 V, Highly Reliable RHBD 10T and 12T SRAM Cells for Aerospace Applications

Aibin Yan, Zhihui He, Jing Xiang, Jie Cui, Yong Zhou, Zhengfeng Huang, P. Girard, X. Wen
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Abstract

Aggressive scaling of CMOS technologies requires to pay attention to the reliability issues of circuits. This paper presents two highly reliable RHBD 10T and 12T SRAM cells, which can protect against single-node upsets (SNUs) and double-node upsets (DNUs). The 10T cell mainly consists of two cross-coupled input-split inverters and the cell can robustly keep stored values through a feedback mechanism among its internal nodes. It also has a low cost in terms of area and power consumption, since it uses only a few transistors. Based on the 10T cell, a 12T cell is proposed that uses four parallel access transistors. The 12T cell has a reduced read/write access time with the same soft error tolerance when compared to the 10T cell. Simulation results demonstrate that the proposed cells can recover from SNUs and a part of DNUs. Moreover, compared with the state-of-the-art hardened SRAM cells, the proposed 10T cell can save 28.59% write access time, 55.83% read access time, and 4.46% power dissipation at the cost of 4.04% silicon area on average.
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两个0.8 V,高可靠的RHBD 10T和12T SRAM电池,用于航空航天应用
CMOS技术的大规模扩展需要关注电路的可靠性问题。本文提出了两种高可靠的RHBD 10T和12T SRAM单元,可以防止单节点宕机(snu)和双节点宕机(dnu)。10T单元主要由两个交叉耦合的输入分路逆变器组成,单元通过内部节点间的反馈机制实现对存储值的鲁棒性保持。它在面积和功耗方面的成本也很低,因为它只使用几个晶体管。在10T电池的基础上,提出了采用4个并联接入晶体管的12T电池。与10T电池相比,12T电池具有相同的软容错能力,并减少了读/写访问时间。仿真结果表明,所提出的细胞可以从snu和部分dnu中恢复。此外,与目前最先进的硬化SRAM单元相比,该10T单元可节省28.59%的写访问时间,55.83%的读访问时间和4.46%的功耗,平均硅面积为4.04%。
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