ISPD 2021 Wafer-Scale Physics Modeling Contest: A New Frontier for Partitioning, Placement and Routing

P. Groeneveld, Michael James, V. Kibardin, I. Sharapov, Marvin Tom, Leo Wang
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引用次数: 2

Abstract

Solving 3-D partial differential equations in a Finite Element model is computationally intensive and requires extremely high memory and communication bandwidth. This paper describes a novel way where the Finite Element mesh points of varying resolution are mapped on a large 2-D homogenous array of processors. Cerebras developed a novel supercomputer that is powered by a 21.5cm by 21.5cm Wafer-Scale Engine (WSE) with 850,000 programmable compute cores. With 2.6 trillion transistors in a 7nm process this is by far the largest chip in the world. It is structured as a regular array of 800 by 1060 identical processing elements, each with its own local fast SRAM memory and direct high bandwidth connection to its neighboring cores. For the 2021 ISPD competition we propose a challenge to optimize placement of computational physics problems to achieve the highest possible performance on the Cerebras supercomputer. The objectives are to maximize performance and accuracy by optimizing the mapping of the problem to cores in the system. This involves partitioning and placement algorithms.
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ISPD 2021晶圆级物理建模竞赛:分区,放置和路由的新前沿
在有限元模型中求解三维偏微分方程需要大量的计算量,并且需要极高的内存和通信带宽。本文描述了一种将不同分辨率的有限元网格点映射到大型二维同质处理器阵列上的新方法。Cerebras公司开发了一种新型超级计算机,该计算机由21.5厘米× 21.5厘米的晶圆级引擎(WSE)提供动力,拥有85万个可编程计算核心。在7纳米工艺中有2.6万亿个晶体管,这是迄今为止世界上最大的芯片。它的结构是一个由800 × 1060个相同处理元素组成的常规数组,每个处理元素都有自己的本地快速SRAM存储器,并直接与邻近核心进行高带宽连接。对于2021年的ISPD竞赛,我们提出了优化计算物理问题放置的挑战,以在Cerebras超级计算机上实现最高性能。目标是通过优化问题到系统核心的映射来最大化性能和准确性。这涉及到分区和放置算法。
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Reinforcement Learning for Placement Optimization Session details: Session 8: Monolithic 3D and Packaging Session ISPD 2021 Wafer-Scale Physics Modeling Contest: A New Frontier for Partitioning, Placement and Routing Scalable System and Silicon Architectures to Handle the Workloads of the Post-Moore Era A Lifetime of ICs, and Cross-field Exploration: ISPD 2021 Lifetime Achievement Award Bio
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