High Performance In-Zn-O FET with High On-current and Ultralow (<10−20 A/μm) Off-state Leakage Current for Si CMOS BEOL Application

N. Saito, T. Sawabe, J. Kataoka, Tomomasa Ueda, T. Tezuka, K. Ikeda
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Abstract

We have demonstrated and experimentally verified the advantages of In-Zn-O (InZnO) channel compared with In-Ga-Zn-O (InGaZnO) channel for high performance oxide semiconductor channel field effect transistor (FET) with both ultralow off-state leakage current and high on-current. Compared with InGaZnO FET, high mobility (>30 cm2/Vs) and reduction of source/drain (S/D) parasitic resistance by 75% were achieved by InZnO FET. Analysis of a Schottky barrier height at S/D contact and a band offset between oxide semiconductor channel and gate insulator SiO2 revealed that the reduction of S/D parasitic resistance originated from a lowering of conduction band minimum by InZnO channel. Moreover, ultralow (<10−20 A/μm) off-state leakage current characteristics including not only S/D leakage current but also gate leakage current were confirmed to maintain even at thin gate insulator with an equivalent oxide thickness of 6.2 nm.
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高性能In-Zn-O场效应管,具有高导通电流和超低(<10−20 A/μm)关断漏电流,用于Si CMOS BEOL应用
我们展示并实验验证了In-Zn-O (InZnO)沟道与In-Ga-Zn-O (InGaZnO)沟道相比在高性能氧化物半导体沟道场效应晶体管(FET)中具有超低的关断漏电流和高的导通电流的优势。与InGaZnO FET相比,InZnO FET具有高迁移率(>30 cm2/Vs)和源/漏(S/D)寄生电阻降低75%的特点。对S/D接触处的肖特基势垒高度和氧化物半导体沟道与栅极绝缘体SiO2之间的能带偏移量的分析表明,InZnO沟道降低了S/D寄生电阻的传导带最小值。此外,即使在等效氧化物厚度为6.2 nm的薄栅极绝缘子上,也能保持超低(<10−20 A/μm)的失态泄漏电流特性,包括S/D泄漏电流和栅极泄漏电流。
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