{"title":"Testing methodology for VLSI","authors":"R. Dutton","doi":"10.1109/ISSCC.1984.1156693","DOIUrl":null,"url":null,"abstract":"The testing problem may dominate cost and even design time for VLSI. Testing at both the system and chip levels will be addressed, stressing the procedures that could be required for full custom versus array-based approaches . . . To be considered too will be the integration of test capability directly on to the chip, and the interface relationships of the designer, producer and test source . . . The techniques which have been successful for MSI and LSI(path scans-LSSD/auto mated test Pattern generation) are likely to fail or have limited applicability for VLSI . . .On-chip testing strategies (self testing of on-board or other macros) may supercede global strategies, such as LSSD...Other equipment and areas that could be involved include the E-beam, and process evaluation and yield maximization testing which may be more appropriate than go/no-go on-board procedures . . .The role of university and education, related to testing and testability, will also be appraised by the panelists.","PeriodicalId":260117,"journal":{"name":"1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1984.1156693","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The testing problem may dominate cost and even design time for VLSI. Testing at both the system and chip levels will be addressed, stressing the procedures that could be required for full custom versus array-based approaches . . . To be considered too will be the integration of test capability directly on to the chip, and the interface relationships of the designer, producer and test source . . . The techniques which have been successful for MSI and LSI(path scans-LSSD/auto mated test Pattern generation) are likely to fail or have limited applicability for VLSI . . .On-chip testing strategies (self testing of on-board or other macros) may supercede global strategies, such as LSSD...Other equipment and areas that could be involved include the E-beam, and process evaluation and yield maximization testing which may be more appropriate than go/no-go on-board procedures . . .The role of university and education, related to testing and testability, will also be appraised by the panelists.
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VLSI测试方法
测试问题可能会影响超大规模集成电路的成本甚至设计时间。将讨论系统和芯片级别的测试,强调完全定制与基于阵列的方法可能需要的程序……将测试能力直接集成到芯片上,以及设计者、生产者和测试源之间的接口关系也是需要考虑的问题。对于MSI和LSI(路径扫描-LSSD/自动测试模式生成)已经成功的技术可能会失败或对VLSI的适用性有限…片上测试策略(板上或其他宏的自我测试)可能会取代全局策略,如LSSD…其他可能涉及的设备和领域包括电子束,工艺评估和产量最大化测试,这可能比使用/不使用机载程序更合适……与测试和可测试性相关的大学和教育的作用也将由小组成员进行评估。
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