Investigation of cooling structure design for PET detector thermal regulation methods

Brian J. Lee, Chen-Ming Chang, Inyong Kwon, C. Levin
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Abstract

Temperature is an essential factor for stable performance of the positron emission tomography (PET). Some of the PET detector components produce significant heat (e.g. readout integrated circuits) that affects its performance. The temperature alters the breakdown voltage of photodetectors, which in turn affects the gain, cross talk, dark count rate and after-pulsing. One of the thermal regulation methods is to use an air/liquid cooling pipe embedded in a cold plate broadly distributing the temperature to the PC board; the gold vias in the board then conduct the temperature to the other side of the board. This paper concentrates on investigating the temperature distribution from various cooling structure configurations. The simulation software COMSOL was used with heat transfer and pipe flow modules to assess the thermal behavior of the cooling system. Two types of cooling pipe arrangements were simulated; a simple and a more complex curve arrangement. For the cold plates, a ceramic (92 W/m-K) and a thermally conductive plastic (10 W/m-K) were simulated. Full as well as “patchy” gold via configurations were also simulated. The simulation was performed for 300 seconds (real time) and the average and the standard deviation temperature of each SiPM was analyzed. With the complex cooling pipe arrangement, the temperature variation throughout all SiPMs was on average 37.9±5.2% higher for ceramic cold plates. For the cold plate materials, the ceramic showed 33.9±15.4% smaller thermal variation and −1.1±0.6% lower temperature compared to the thermally conductive plastic. The patchy vias resulted in 218.2±74.9% larger thermal variation when compared to the patchy vias. In summary, we have simulated various cooling pipe designs, cold plates and gold via distribution configurations to analyze the temperature variation across a PET detector PC board. The thermally conductive ceramic cold plate with as many vias as possible resulted in the most stable temperature variation.
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PET探测器热调节方法的冷却结构设计研究
温度是影响正电子发射层析成像(PET)稳定性能的重要因素。某些PET检测器组件(如读出集成电路)会产生显著的热量,从而影响其性能。温度改变光电探测器的击穿电压,进而影响增益、串扰、暗计数率和后脉冲。其中一种热调节方法是利用嵌入冷板中的空气/液体冷却管将温度广泛地分布到PC板上;板上的金孔然后将温度传导到板的另一边。本文着重研究了不同冷却结构形式下的温度分布。采用COMSOL仿真软件,结合传热和管流模块对冷却系统的热行为进行了评估。模拟了两种冷却管布置方式;一个简单的和一个更复杂的曲线排列。对于冷板,模拟了陶瓷(92 W/m-K)和导热塑料(10 W/m-K)。通过配置也模拟了完整的和“不完整”的黄金。模拟时间为300秒(实时),分析各SiPM的平均温度和标准差。在复杂的冷却管布置下,陶瓷冷板的温度变化平均高出37.9±5.2%。对于冷板材料,陶瓷的热变化比导热塑料小33.9±15.4%,温度比导热塑料低- 1.1±0.6%。斑片通孔的热变化比斑片通孔大218.2±74.9%。综上所述,我们通过分布配置模拟了各种冷却管设计,冷板和金,以分析PET检测器PC板上的温度变化。具有尽可能多的通孔的导热陶瓷冷板可以获得最稳定的温度变化。
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