Two-dimensional CVD profile simulator based on ballistic transport and reaction model

T. Maruizumi, Y. Takemura, J. Ushio, M. Miyao
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引用次数: 2

Abstract

We have extended the two-dimensional deposition simulator with a micrometer feature scale based on the ballistic transport and reaction model originally developed by Cale et al. (1993) to include a scheme to inhibit and/or accelerate the deposition reaction stemming from the product gases. We have also improved the algorithm used to calculate a self-consistent gas flux distribution on micro features at each step in the simulation. Application of this deposition simulator to seven CVD systems for ULSI usage showed good agreement between the calculated and experimental feature profiles. The validity of the reactive sticking coefficient's role as a general descriptor for step coverage characteristics was thoroughly examined using these simulated results and we concluded that the intrinsic reaction mechanism is more reliable than the sticking coefficient for all CVD characteristics. Molecular orbital calculation was also demonstrated to be extremely helpful in clarifying the intrinsic deposition mechanism.
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基于弹道输运和反应模型的二维CVD廓线模拟器
我们在最初由Cale等人(1993)开发的弹道传输和反应模型的基础上,扩展了微米特征尺度的二维沉积模拟器,以包括抑制和/或加速源自产物气体的沉积反应的方案。我们还改进了用于计算模拟中每一步微特征上自洽气体通量分布的算法。将该沉积模拟器应用于七个用于ULSI的CVD系统,计算结果与实验结果吻合较好。利用这些模拟结果,我们彻底检验了反应性粘附系数作为台阶覆盖特性的一般描述符的有效性,并得出结论,对于所有CVD特性,本征反应机理比粘附系数更可靠。分子轨道计算也被证明对阐明内在沉积机制非常有帮助。
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