Device and process modeling: 20 Years at Intel's other fab

M. Stettler
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引用次数: 2

Abstract

Embedding TCAD engineers in technology working groups has been an integral part of Intel's process development strategy since the company's inception. While this strategy remains the same, the challenges faced and the tools used by TCAD has undergone dramatic change over the last 20 years. This talk will discuss three recent trends in process and device TCAD: the rise in the use of “atomistic” scale simulations, the focus on modeling defects, and the continuing need to bridge new, more physically rigorous approaches to older, more computationally efficient methods. These trends will be illustrated with recent TCAD studies conducted at Intel.
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器件和工艺建模:在英特尔其他工厂工作了20年
自英特尔公司成立以来,在技术工作组中嵌入TCAD工程师一直是英特尔工艺开发战略的一个组成部分。虽然这一策略保持不变,但在过去20年里,TCAD面临的挑战和使用的工具发生了巨大变化。本次演讲将讨论过程和设备TCAD的三个最新趋势:“原子”尺度模拟的使用增加,对建模缺陷的关注,以及将新的、更严格的物理方法与旧的、更计算高效的方法连接起来的持续需求。这些趋势将在英特尔最近进行的TCAD研究中得到说明。
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