Recent Advances in GaN-on-SiC HEMT Reliability and Microwave Performance within the DARPA WBGS-RF Program

M. Rosker
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引用次数: 7

Abstract

The Wide Band Gap Semiconductor for RF Applications (WBGS-RF) program, supported by the Defense Advanced Research Projects Agency (DARPA), is developing microwave and millimeter-wave gallium nitride-based devices on silicon carbide substrates. Recent advances within Phase II of the Program include excellent results for both performance and reliability. Significant progress has been made towards developing manufacturable wide-bandgap devices that provide outstanding performance at reliability levels that will allow their use in a wide variety of high frequency, high power applications.
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DARPA WBGS-RF项目中GaN-on-SiC HEMT可靠性和微波性能的最新进展
宽带隙射频应用半导体(WBGS-RF)项目由美国国防高级研究计划局(DARPA)支持,正在开发基于碳化硅衬底的微波和毫米波氮化镓器件。该计划第二阶段的最新进展包括性能和可靠性方面的优异结果。在开发可制造的宽带隙器件方面取得了重大进展,这些器件在可靠性水平上提供了出色的性能,这将允许它们在各种高频、高功率应用中使用。
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