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2007 IEEE Compound Semiconductor Integrated Circuits Symposium最新文献

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High-Speed Analog-to-Digital Converters in SiGe Technologies SiGe技术中的高速模数转换器
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.23
Jaesik Lee
SiGe-based high-speed ADCs are promising for emerging higher frequency band applications such as coherent optical systems or millimeter-wave radios because of the inherent advantages of high-speed, high integration, and high yield technology. This paper addresses recent developments in high-speed ADCs in SiGe technology. An approach is then presented for development of ultra-high-speed ADCs for the next-generation wired or wireless communication systems.
基于sigg的高速adc由于其高速、高集成度和高产量技术的固有优势,在新兴的高频段应用(如相干光学系统或毫米波无线电)中前景广阔。本文介绍了SiGe技术中高速adc的最新发展。然后提出了一种用于下一代有线或无线通信系统的超高速adc的开发方法。
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引用次数: 9
An Integrated 19-GHz Low-Phase-Noise Frequency Synthesizer in SiGe BiCMOS Technology 基于SiGe BiCMOS技术的集成19ghz低相位噪声频率合成器
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.44
S. Osmany, F. Herzel, J. Scheytt, K. Schmalz, W. Winkler
We present a fully integrated phase-locked loop tunable from 17.5 GHz to 19.2 GHz fabricated in a 0.25 mum SiGe BiCMOS technology. The measured phase noise is below -110 dBc/Hz at 1 MHz offset over the whole tuning range. Based on an integer-N architecture, the synthesizer consumes 248 mW and occupies a chip area of 2.1 mm including pads. Quadrature outputs at quarter of the oscillator frequency are produced, which are required in a sliding-IF 24 GHz transceiver. Possible applications include wireless LAN as well as satellite communication. The measured phase noise is the lowest among previously published Si-based integrated synthesizers above 12 GHz.
我们提出了一个完全集成的锁相环,可在17.5 GHz至19.2 GHz范围内调谐,采用0.25 μ SiGe BiCMOS技术制造。在整个调谐范围内,测量到的相位噪声低于-110 dBc/Hz,偏移量为1mhz。基于整数n架构,合成器功耗为248 mW,芯片面积为2.1 mm(包括焊盘)。产生四分之一振荡器频率的正交输出,这是滑动中频24ghz收发器所需要的。可能的应用包括无线局域网和卫星通信。测量的相位噪声是先前发表的12 GHz以上硅基集成合成器中最低的。
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引用次数: 8
A Low-Power CMOS VCO for 2.4GHz WLAN 一种用于2.4GHz WLAN的低功耗CMOS压控振荡器
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.42
H. Choi, Q. Bui, C. Park
In this paper, a 2.4-GHz low-power LC VCO with high performance in phase noise is designed and implemented in 0.18um CMOS process for IEEE 802. llg WLAN. Based on measurement results, it has the phase noise of -121.11dBc/Hz @lMHz offset from a 2.4GHz carrier. The total power dissipation is only 0.675 mW at 1.2-V power supply voltage. The oscillator is tuned from 2.28 GHz to 2.47 GHz while a tuning voltage varies from 0 V to 1.8 V. Within the author's knowledge, this VCO has the lowest phase noise among the VCOs which consume less-than-1 mW power.
本文设计并实现了一种采用0.18um CMOS工艺、面向ieee802的2.4 ghz低功耗高性能LC压控振荡器。llg WLAN。根据测量结果,它的相位噪声为-121.11dBc/Hz @lMHz从2.4GHz载波偏移。在1.2 v电源电压下,总功耗仅为0.675 mW。振荡器从2.28 GHz调谐到2.47 GHz,调谐电压在0 V到1.8 V之间变化。据作者所知,该VCO在功耗小于1 mW的VCO中具有最低的相位噪声。
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引用次数: 7
Statistical Large-Signal Model Enabling Yield Optimization in High-Power Amplifier Design 统计大信号模型实现高功率放大器设计的良率优化
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.25
W. Stiebler, Pavlos Kolias, J. Sanctuary
A statistical large-signal model is presented that allows for optimizing yield of high-power amplifier MMICs. The modeling technique is based on the transformation of process control data into modeling parameters of an empirical, compact large-signal device model, followed by a multi-variant statistical analysis, resulting in a full set of principal components for both the current and the charge model. The model component has been implemented into ADS (Agilent) and an automated software periodically updates the statistical model parameters.
提出了一个统计大信号模型,用于优化高功率放大器mmic的良率。建模技术的基础是将过程控制数据转换为经验的、紧凑的大信号装置模型的建模参数,然后进行多变量统计分析,从而得到电流和电荷模型的全套主成分。该模型组件已在ADS (Agilent)中实现,并且自动软件定期更新统计模型参数。
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引用次数: 5
Demonstration of a S-MMIC LNA with 16-dB Gain at 340-GHz 一种增益为16db的340ghz S-MMIC LNA演示
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.19
W. Deal, X. Mei, V. Radisic, W. Yoshida, P. Liu, J. Uyeda, M. Barsky, T. Gaier, A. Fung, R. Lai
In this paper, an amplifier with a significant amount of gain is demonstrated at sub-millimeter wave frequencies (f > 300-GHz) for the first time. The three stage amplifier uses advanced InP HEMT transistors to realize 16-dB gain at 340-GHz and > 20 dB gain at 280-GHz. The amplifier demonstrates > 100 GHz of bandwidth with gain > 10 dB. This paper demonstrates that full WR-3 waveguide band (220-325 GHz) InP HEMT amplifiers are currently possible and that current device capabilities enable operation well into the sub-millimeter wave regime.
本文首次在亚毫米波频率(f > 300 ghz)下演示了一种具有显著增益的放大器。三级放大器采用先进的InP HEMT晶体管,在340 ghz时可实现16 dB增益,在280 ghz时可实现> 20 dB增益。该放大器的带宽> 100ghz,增益> 10db。本文论证了WR-3全波导带(220-325 GHz) InP HEMT放大器目前是可能的,并且目前的器件能力能够很好地运行到亚毫米波区域。
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引用次数: 58
A 1.2V 15.6mW 81GHz 2:1 Static CML Frequency Divider with a Band-Pass Load in a 90nm SOI CMOS Technology 基于90nm SOI CMOS技术的1.2V 15.6mW 81GHz 2:1静态CML分频器带通负载
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.28
J. Plouchart, Daiek Kim, Jonghae Kim, V. Karam, C. Plett, Choongyeun Cho, R. Trzcinski
A 2:1 static frequency divider using a bandpass load was fabricated in a digital 90 nm SOI CMOS technology. The divider exhibits a maximum operating frequency of 81 GHz at 1.2 V, and a core power of 15.6 mW. The divider can operate down to 0.5 V at a maximum operating frequency of 75.6 GHz with a core power of 2.75 mW.
采用数字90nm SOI CMOS技术制备了带通负载的2:1静态分频器。该分压器在1.2 V时的最大工作频率为81 GHz,核心功率为15.6 mW。该分压器工作电压低至0.5 V,最大工作频率为75.6 GHz,核心功率为2.75 mW。
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引用次数: 6
Nanoscale CMOS for mm-Wave Applications 毫米波应用的纳米级CMOS
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.37
A. Niknejad, S. Emami, B. Heydari, M. Bohsali, E. Adabi
Aggressive technology scaling of CMOS has culminated in a low-cost high volume commercial process technology with Ft > 150 GHz and Fmax > 200 GHz. This paper discusses the key trends in CMOS scaling that have led to this level of performance and attempts to predict the performance down to 45 nm. The design of active and passive components in CMOS for power gain and low noise are discussed in detail and unique features of CMOS technology are highlighted. Experimental results derived from a 60 GHz amplifier in 90 nm CMOS and a complete 60 GHz front-end receiver in 130 nm CMOS are reported.
CMOS积极的技术扩展在低成本的大批量商用工艺技术中达到顶峰,Ft >为150 GHz, Fmax >为200 GHz。本文讨论了导致这种性能水平的CMOS缩放的关键趋势,并试图预测性能降至45纳米。详细讨论了CMOS中功率增益和低噪声的有源和无源元件的设计,突出了CMOS技术的独特之处。本文报道了一个60 GHz的90 nm CMOS放大器和一个完整的130 nm CMOS 60 GHz前端接收器的实验结果。
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引用次数: 23
Recent Performance of Nonpolar and Semipolar GaN-Based Light Emitting Diodes and Laser Diodes 非极性和半极性氮化镓基发光二极管和激光二极管的最新性能
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.47
D. Feezell, S. Denbaars, J. Speck, S. Nakamura
This article discusses recent advances of nonpolar and semipolar GaN-based light emitting diodes (LEDs) and laser diodes (LDs). Devices fabricated on these alternative orientations are already beginning to realize significant performance milestones. Nonpolar GaN has been employed to facilitate high-power LEDs and to realize CW operation of novel AlGaN-cladding-free LD structures. Semipolar GaN has also been successfully used to demonstrate LDs and to realize high-power, high-efficiency green LEDs.
本文讨论了非极性和半极性氮化镓基发光二极管和激光二极管的最新进展。在这些替代方向上制造的器件已经开始实现重要的性能里程碑。非极性氮化镓已被应用于高功率led和实现新型无氮化镓LD结构的连续运行。半极性氮化镓也已成功地用于演示ld和实现高功率,高效率的绿色led。
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引用次数: 4
High-Power and High-Voltage AlGaN/GaN HEMTs-on-Si 大功率高压AlGaN/GaN HEMTs-on-Si
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.11
Chris Park, A. Edwards, P. Rajagopal, W. Johnson, S. Singhal, A. Hanson, Quinn Martin, E. Piner, K. Linthicum, I. Kizilyalli
GaN-on-Silicon technology is a highly manufacturable, reliable, and cost effective AlGaN/GaN HEMT platform. Maximum RF performance (power and efficiency) can be achieved by addressing two main areas related to the silicon substrate: the RF loss to the silicon substrate and the thermal resistance of the device to the heat sink. In this paper, we will report on how the two areas can be addressed in a realistic environment to enable high power, high voltage operation. This device technology can be used to develop high power amplifiers that are significantly smaller, lighter, and operate over a broad bandwidth.
GaN-on- silicon技术是一种高度可制造,可靠且具有成本效益的AlGaN/GaN HEMT平台。最大的射频性能(功率和效率)可以通过解决与硅衬底相关的两个主要领域来实现:硅衬底的射频损耗和器件对散热器的热阻。在本文中,我们将报告如何在现实环境中解决这两个领域,以实现高功率,高电压的操作。这种器件技术可用于开发更小、更轻、工作带宽更宽的高功率放大器。
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引用次数: 3
100-200 GHz CMOS Signal Sources and Detectors 100-200 GHz CMOS信号源和检测器
Pub Date : 2007-11-19 DOI: 10.1109/CSICS07.2007.61
K. O, C. Cao, E. Seok, S. Sankaran
The feasibility of CMOS circuits operating at frequencies near 200 GHz has been demonstrated. A 140-GHz fundamental mode VCO in 90-nm CMOS, a 192-GHz push-push VCO in 130-nm CMOS, and a 180-GHz detector circuit in 130nm CMOS have been demonstrated. With the continued scaling of MOS transistors, 1-THz CMOS circuits will be possible in the near future. Index Terms – CMOS, mm-wave, oscillator, Schottky diode, detector, phase locked loop, terahertz.
CMOS电路在200 GHz频率附近工作的可行性已经被证明。介绍了一种90纳米CMOS的140 ghz基模压控振荡器、130纳米CMOS的192 ghz推推式压控振荡器和130纳米CMOS的180 ghz探测器电路。随着MOS晶体管的不断缩小,1太赫兹CMOS电路将在不久的将来成为可能。索引术语- CMOS,毫米波,振荡器,肖特基二极管,探测器,锁相环,太赫兹。
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引用次数: 7
期刊
2007 IEEE Compound Semiconductor Integrated Circuits Symposium
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