{"title":"Different electrical measuring techniques of package and interconnect parasitics for high speed VLSI devices","authors":"C. Huang, F. Wong, D. Kim","doi":"10.1109/NORTHC.1994.643327","DOIUrl":null,"url":null,"abstract":"This paper will discuss several measuring techniques that are used in the industry today for extraction of electrical parasitics of packages and interconnects. Specifically, the techniques that will be covered are the SEMI-Standard (G23-84) method, the impedance method, and the network analysis method. The data measured from these methods will be presented. Theoretical analysis and simulation results from software will be compared to discuss the advantages and disadvantages of each method.","PeriodicalId":218454,"journal":{"name":"Proceedings of NORTHCON '94","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1994-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of NORTHCON '94","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NORTHC.1994.643327","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper will discuss several measuring techniques that are used in the industry today for extraction of electrical parasitics of packages and interconnects. Specifically, the techniques that will be covered are the SEMI-Standard (G23-84) method, the impedance method, and the network analysis method. The data measured from these methods will be presented. Theoretical analysis and simulation results from software will be compared to discuss the advantages and disadvantages of each method.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
