Digital electrostatic acoustic transducer array

A. Arevalo, D. Castro, D. Conchouso, J. Kosel, I. Foulds
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引用次数: 3

Abstract

In this paper we present the fabrication and characterization of an array of electrostatic acoustic transducers. The array is micromachined on a silicon wafer using standard micro-machining techniques. Each array contains 2n electrostatic transducer membranes, where “n” is the bit number. Every element of the array has a hexagonal membrane shape structure, which is separated from the substrate by 3μm air gap. The membrane is made out 5μm thick polyimide layer that has a bottom gold electrode on the substrate and a gold top electrode on top of the membrane (250nm). The wafer layout design was diced in nine chips with different array configurations, with variation of the membrane dimensions. The device was tested with 90 V giving and sound output level as high as 35dB, while actuating all the elements at the same time.
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数字静电声换能器阵列
在本文中,我们提出了一组静电声换能器的制造和表征。该阵列采用标准的微加工技术在硅片上进行微加工。每个阵列包含2n个静电换能器膜,其中“n”为位位数。阵列的每个元件都具有六角形膜状结构,与衬底之间有3μm的气隙。该薄膜由5μm厚的聚酰亚胺层制成,在衬底上有一个底部金电极,在薄膜顶部有一个顶部金电极(250nm)。晶圆布局设计分为9个芯片,不同的阵列配置,不同的膜尺寸。该设备在同时驱动所有元件的情况下,以90v的电压和高达35dB的声音输出电平进行测试。
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