Effect of carrier doping on the thermal conductivity of MNiSn based half-Heusler alloy

H. Muta, T. Kanemitsu, K. Kurosaki, S. Yamanaka
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引用次数: 4

Abstract

Thermal conductivity of doped MNiSn (M = Ti, Zr) half-Heusler alloys has been investigated from room temperature to 1000 K. Nonnegligible increase of thermal conductivity was observed for all the samples at high temperature. The temperature dependence appeared to the corresponding to the change of electrical properties and carrier concentration, indicating that the electron-hole pair generation caused the increase of thermal conductivity. The effect, called ambipolar diffusion effect, depends on a bandgap and a ratio of electron and hole conduction. In this study the bandgap was determined from electrical conductivity of yttrium doped of ZrNiSn and the temperature dependence of the ambipolar diffusion effect was quantitatively investigated
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载流子掺杂对MNiSn基半heusler合金导热性能的影响
研究了掺杂MNiSn (M = Ti, Zr)半heusler合金在室温至1000 K范围内的热导率。在高温下,所有样品的导热系数都有不可忽略的增加。电学性质和载流子浓度的变化均表现出温度依赖性,表明电子-空穴对的产生导致了导热系数的增加。这种效应被称为双极性扩散效应,取决于带隙和电子与空穴传导的比例。本研究利用掺杂ZrNiSn的钇的电导率来确定带隙,并定量研究了双极性扩散效应的温度依赖性
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