Goldilocks failures: Not too soft, not too hard

S. Nassif, V. Kleeberger, Ulf Schlichtmann
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引用次数: 19

Abstract

It is well known that circuits fail when one or more of the constituent components fails, due -for example- to phenomena such as electromigration in wires. Such hard failures, typically due to topological changes in circuit connectivity, are treated distinctly from soft failures which could be due to components drifting out of spec over time. However, in certain types of circuits, such as memory, the distinction between soft and hard failures is not clearly defined. The primary cause of the blurring between these two phenomena is manufacturing variability, which can make a topologically correct circuit behave as if it had a short or an open. This paper will show the linkage between these two failure types, and show how increasing variability in future technologies will likely exacerbate this problem further.
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金凤花失败:不要太软,也不要太硬
众所周知,当一个或多个组成元件失效时,电路会失效,例如,由于电线中的电迁移等现象。这种硬故障通常是由于电路连接的拓扑变化造成的,与软故障的处理方式截然不同,软故障可能是由于组件随着时间的推移偏离了规格。然而,在某些类型的电路中,例如存储器,软故障和硬故障之间的区别并没有明确定义。这两种现象之间模糊的主要原因是制造变异性,它可以使拓扑正确的电路表现得好像它有短路或开路。本文将展示这两种故障类型之间的联系,并展示未来技术中日益增加的可变性如何可能进一步加剧这一问题。
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