AlN bulk single crystal growth on SiC and AlN substrates by sublimation method

I. Nagai, Tomohisa Kato, Tomonori Miura, Hiroyuki Kamata, K. Naoe, K. Sanada, H. Okumura
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引用次数: 2

Abstract

Aluminum nitride (AlN) bulk single crystals up to 45 mm in diameter and 10 mm in thickness have been successfully grown on 6H-SiC(0001) substrates by the sublimation method. Moreover, high growth rate of 200μm/h has been achieved by high temperature homo-epitaxial AlN growth on AlN(0001) substrate. The Raman spectrum indicates that the polytype of the grown AlN single crystals is a Wurtzite-2H type structure, and the crystals do not include any impurity phases. In both the hetero- and homo-epitaxial AlN bulk single crystal growth, the quality at the top of the crystal improves as the crystal thickness increases along the <0001> direction during the growth: low etch pit density 7 × 104 cm−2 and 1 × 104 cm−2 have been achieved at a thickness of 8 mm and 2 mm in the hetero- and homo-epitaxial growth, respectively.
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用升华法在SiC和AlN衬底上生长AlN块状单晶
利用升华法在6H-SiC(0001)衬底上成功生长出直径达45 mm、厚度达10 mm的氮化铝(AlN)块状单晶。此外,在AlN(0001)衬底上高温同质外延生长的AlN达到了200μm/h的高生长速率。拉曼光谱结果表明,生长的AlN单晶为Wurtzite-2H型结构,且不含杂质相。在异质外延和同质外延的AlN块体单晶生长中,随着晶体沿生长方向厚度的增加,晶体顶部的质量得到改善:在异质外延和同质外延生长中,在厚度为8 mm和2 mm时,分别达到了7 × 104 cm−2和1 × 104 cm−2的低蚀刻坑密度。
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