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2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)最新文献

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Ultra-low threshold 1490 nm surface-emitting BH-DFB laser diode with integrated monitor photodiode 超低阈值1490nm表面发射BH-DFB激光二极管,集成监控光电二极管
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516156
M. Moehrle, J. Kreissl, W. Molzow, G. Przyrembel, C. Wagner, A. Sigmund, L. Moerl, N. Grote
1490nm surface emitting BH-DFB-laser diodes incorporating a 45° turning mirror and an integrated monitor photodiode are presented for the first time. The devices show VCSEL-like threshold currents of as low as 3…7mA in the operation temperature range between 20°C and 90°C and a modulation bandwidth of >8GHz. The integrated monitor diode operates temperature independent and is therefore well suited for laser power control.
首次提出了1490nm面发射bh - dfb激光二极管,该激光二极管采用45°旋转反射镜和集成监控光电二极管。该器件在20°C至90°C的工作温度范围内显示出类似vcsel的阈值电流低至3…7mA,调制带宽>8GHz。集成的监测二极管工作温度无关,因此非常适合激光功率控制。
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引用次数: 12
Fabrication and characterization of 200-nm self-aligned In0.53Ga0.47As MOSFET 200nm自对准In0.53Ga0.47As MOSFET的制备与表征
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5515926
A. Olivier, N. Wichmann, J. Mo, A. Noudéviwa, Y. Roelens, L. Desplanque, X. Wallart, F. Danneville, G. Dambrine, S. Bollaert, F. Martin, O. Desplats, J. Saint-Martin, M. Shi, Y. Wang, M. Chauvat, P. Ruterana, H. Maher
In this paper, a 200 nm n-channel inversion-type self-aligned In0.53Ga0.47As MOSFET with a Al2O3 gate oxide deposited by Atomic Layer Deposition (ALD) is demonstrated. Two ion implantation processes using silicon nitride side-wall are performed for the fabrication of the n-type source and drain regions. The 200 nm gate-length MOSFET with a gate oxide thickness of 8 nm features the transconductance of 70 mS/mm and the maximum drain current of 200 mA/mm.
本文用原子层沉积法(ALD)制备了一个200 nm n沟道反转型自对准In0.53Ga0.47As MOSFET。采用氮化硅侧壁离子注入工艺制备了n型源极和漏极。200 nm栅长MOSFET,栅极氧化物厚度为8 nm,其跨导率为70 mS/mm,最大漏极电流为200 mA/mm。
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引用次数: 2
MOVPE regrowth steps for high power Quantum Cascade Lasers 高功率量子级联激光器的MOVPE再生步骤
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516056
O. Parillaud, M. Carras, G. Maisons, B. Simozrag, M. Garcia, X. Marcadet, F. Alexandre, O. Patard, F. Pommereau, O. Drisse
We report on the realization of both Distributed Feedback (DFB) and Fabry-Pérot (FP) Quantum Cascade Lasers (QCLs) at Alcatel Thales III-V Lab, involving MOVPE regrowth steps for the realization of the upper cladding and buried ridge structures. We present our results on both device types. Optimization of the planarization process as well as reduction of the thermal resistance achieved using semi-insulating InP:Fe for regrowth is shown and performance perspectives using these building blocks are addressed.
我们报告了在阿尔卡特泰雷兹III-V实验室实现分布式反馈(DFB)和fabry - p (FP)量子级联激光器(qcl),包括实现上包层和埋脊结构的MOVPE再生步骤。我们展示了两种设备类型的结果。展示了使用半绝缘InP:Fe进行再生的平面化过程的优化以及热阻的降低,并讨论了使用这些构建块的性能前景。
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引用次数: 0
TM mode waveguide isolator monolithically integrated with InP active devices TM模式波导隔离器与InP有源器件单片集成
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516289
G. Takahashi, T. Amemiya, Takuo Tanemura, A. Higo, K. Takeda, Y. Nakano
We propose and experimentally demonstrate a novel structure for monolithically integrating a TM-mode waveguide optical isolator with active InP devices. A semiconductor ring laser with integrated isolator is fabricated and demonstrated for the first time.
我们提出并实验证明了一种将tm模波导光隔离器与有源InP器件单片集成的新结构。首次研制并演示了集成隔离器的半导体环形激光器。
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引用次数: 4
Epitaxial III-V planar nanowires: Self-aligned, high-mobility and transfer-printable 外延III-V平面纳米线:自对准、高迁移率和可转移打印
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516728
S. Fortuna, R. Dowdy, Xiuling Li
We present planar, self-aligned, twin-free, and high-mobility GaAs semiconductor nanowires epitaxially grown on (100) and (110) GaAs substrates. In addition, such planar nanowires are directly transfer-printable and compatible with existing processing technology and integratable with various devices.
我们在(100)和(110)GaAs衬底上外延生长了平面、自对准、无双晶和高迁移率的GaAs半导体纳米线。此外,这种平面纳米线可直接转移打印,与现有的加工技术兼容,可与各种器件集成。
{"title":"Epitaxial III-V planar nanowires: Self-aligned, high-mobility and transfer-printable","authors":"S. Fortuna, R. Dowdy, Xiuling Li","doi":"10.1109/ICIPRM.2010.5516728","DOIUrl":"https://doi.org/10.1109/ICIPRM.2010.5516728","url":null,"abstract":"We present planar, self-aligned, twin-free, and high-mobility GaAs semiconductor nanowires epitaxially grown on (100) and (110) GaAs substrates. In addition, such planar nanowires are directly transfer-printable and compatible with existing processing technology and integratable with various devices.","PeriodicalId":197102,"journal":{"name":"2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122652899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Investigation of bonding strength and photoluminescence properties of InP/Si surface activated bonding InP/Si表面活化键合强度及光致发光性能研究
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516096
S. Kondo, T. Okumura, R. Osabe, N. Nishiyama, S. Arai
A low-temperature direct wafer bonding technique has been researched by using plasma treatment. Si-to-Si direct bonding strength was 1.6 MPa by using plasma pretreatment prior to the heating and weighting. 1.4 MPa of InP/Si bonding strength was obtained by improving chemical cleaning process. On the other hand, photoluminescence properties of GaInAs/InP quantum wells bonded on Si substrate were investigated. An introduction of a 30-nm-thick superlattice buffer on the top of the wafer greatly suppressed photoluminescence intensity degradation near the bonded interface.
研究了采用等离子体处理的低温直接晶圆键合技术。在加热和称重前采用等离子体预处理,硅对硅直接结合强度为1.6 MPa。通过改进化学清洗工艺,获得了1.4 MPa的InP/Si结合强度。另一方面,研究了结合在Si衬底上的GaInAs/InP量子阱的光致发光特性。在晶圆顶部引入30nm厚的超晶格缓冲层,极大地抑制了键合界面附近的光致发光强度下降。
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引用次数: 3
Investigation of the origin of InAs dot formation at the growth interrupted AlGaInAs hetero-interface grown by MOVPE MOVPE生长中断AlGaInAs异质界面处InAs点形成原因的研究
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516035
T. Nagira, K. Ono, M. Takemi
In the growth of AlGaInAs/InP material system by metal organic vapor phase epitaxy (MOVPE), there are many hillocks on the wafer in some growth conditions. We analyzed the hillocks by TEM and EDX and found that the origin of the hillocks is InAs dots on growth interrupted interface. In addition, we investigated the growth condition dependence of hillock distribution in details, and revealed the origin and the mechanism of the formation of InAs dots.
在金属有机气相外延(MOVPE)生长AlGaInAs/InP材料体系的过程中,在某些生长条件下,晶圆上存在许多小山丘。通过TEM和EDX分析发现,这些小丘是生长中断界面上的InAs点形成的。此外,我们还详细研究了山丘分布对生长条件的依赖性,揭示了InAs点的起源和形成机制。
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引用次数: 0
Room temperature picosecond mode-locked pulse generation from a 1.55µm VECSEL with an InGaAsN/GaAsN fast saturable absorber mirror 采用InGaAsN/GaAsN快速饱和吸收镜的1.55 μ m VECSEL产生室温皮秒锁模脉冲
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5515998
A. Khadour, S. Bouchoule, J. Decobert, J. Harmand, J. Oudar
A 1.55µm VECSEL with a metal-GaAs/AlAs hybrid metamorphic mirror optimized for high power room temperature operation has been assembled with a fast saturable absorber mirror (SESAM) in a four-mirror cavity to generate mode-locked pulses at a frequency of 2 GHz. Stable pulses are obtained at room temperature avoiding the need for water cooling, with a pulsewidth < 2 ps and an average optical power at the output coupling mirror of 10 mW. The RF linewidth of the free running laser has been measured to be less than 1000 Hz.
一个1.55µm的VECSEL与一个快速饱和吸收镜(SESAM)组装在一个四镜腔中,产生频率为2ghz的锁模脉冲。VECSEL具有优化的高功率室温工作金属- gaas /AlAs混合变质镜。在室温下获得了稳定的脉冲,避免了水冷却的需要,脉冲宽度< 2 ps,输出耦合镜的平均光功率为10 mW。经测量,自由运行激光器的射频线宽小于1000hz。
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引用次数: 0
Investigation of SiO2 on AlGaAs prepared by liquid phase deposition 液相沉积法制备AlGaAs表面SiO2的研究
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516132
Kuan-Wei Lee, Jung-Sheng Huang, Yu-Lin Lu, F. Lee, H. Lin, J. Huang, Yeong-Her Wang
The liquid phase deposition (LPD) was used to deposit silicon oxide (SiO2) layer on AlGaAs near room temperature. The LPD method is not only simple but also can obtain the SiO2 very economically. Both the aqueous solution of hydro-fluosilicic acid (H2SiF6) and boric acid (H3BO3) were used for the LPD solution. After rapid temperature annealing (RTA) at 300°C for 1 min, the leakage current density is ~ 4.24 × 10−7 A/cm2 at 1 MV/cm, and the interface trap density is ~ 1.7 × 1011 cm−2eV−1 for the LPD-SiO2 thickness of 29 nm.
采用液相沉积法(LPD)在AlGaAs表面近室温沉积氧化硅(SiO2)层。LPD法不仅简单,而且可以非常经济地获得SiO2。LPD溶液采用氢氟硅酸(H2SiF6)和硼酸(H3BO3)水溶液。当LPD-SiO2厚度为29 nm时,在300℃下快速退火1 min后,漏电流密度为~ 4.24 × 10−7 A/cm2,界面阱密度为~ 1.7 × 1011 cm−2eV−1。
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引用次数: 0
Dependence of threshold current density on quantum well composition for compressive strained-layer AlxGayIn1−x−yAs lasers 压缩应变层AlxGayIn1−x−yAs激光器阈值电流密度与量子阱组成的关系
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516084
D. Sapkota, M. S. Kayastha, K. Wakita
Separate confinement AlGaInAs/InP compressive strained quantum well lasers especially in the wavelength range of 1.55 μm and 1.3 μm with 7.6 nm well thick have been studied. Threshold current density and emission wavelengths have been calculated as a function of well composition. A minimum of threshold current density of 146 Acm−2 was obtained for the devices with Al0.1Ga0.16In0.74As well which is the lowest value ever reported at this well composition.
本文研究了分离约束AlGaInAs/InP压缩应变量子阱激光器,特别是波长范围为1.55 μm和1.3 μm,阱厚为7.6 nm的激光器。计算了阈值电流密度和发射波长作为井成分的函数。对于Al0.1Ga0.16In0.74As的器件,最小阈值电流密度为146 Acm−2,这是该井组成中报道的最低值。
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引用次数: 1
期刊
2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)
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