MOS devices with high quality ultra thin CVD ZrO/sub 2/ gate dielectrics and self-aligned TaN and TaN/poly-Si gate electrodes

C. Lee, Y.H. Kim, H. Luan, S.J. Lee, T. Jeon, W. Bai, D. Kwong
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引用次数: 18

Abstract

In this paper, we have successfully fabricated and characterized self-aligned TaN and TaN/poly-Si gated n-MOSFETs with ultra thin (EOT=11 /spl Aring/) CVD ZrO/sub 2/ gate dielectrics. It is show that while both gate stacks show excellent leakage current and good thermal stability after a 900/spl deg/C, 30 s, N/sub 2/ anneal, the TaN/poly-Si ZrO/sub 2/ devices exhibit superior thermal stability even after 1000/spl deg/C, 30 s, N/sub 2/ anneal. In addition, the TaN/poly-Si devices show negligible frequency dependence of CV, charge trapping, and superior TDDB characteristics, compared to TaN devices. Well-behaved N-MOSFETs with both TaN and TaN/poly-Si gate electrodes are demonstrated.
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具有高质量超薄CVD ZrO/sub /栅极介质和自对准TaN和TaN/多晶硅栅极的MOS器件
在本文中,我们成功地制备和表征了超薄(EOT=11 /spl /) CVD ZrO/sub /栅极介质的自对准TaN和TaN/多晶硅门控n- mosfet。结果表明,在900/spl℃,30 s, N/sub 2/退火后,两个栅极堆都表现出优异的漏电流和良好的热稳定性,而TaN/多晶硅ZrO/sub 2/器件即使在1000/spl℃,30 s, N/sub 2/退火后也表现出优异的热稳定性。此外,与TaN器件相比,TaN/多晶硅器件对CV、电荷捕获和TDDB特性的频率依赖性可以忽略不计。性能良好的n - mosfet具有TaN和TaN/多晶硅栅电极。
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