Compact, modular assembly and packaging of multi-substrate microsystems

Abstract

This paper presents a new approach for the assembly of microsystems consisting of multiple substrates containing circuits, sensors, and actuators in a re-workable and modular fashion. The microsystem dice are placed inside a cube, and therefore self-aligned and stacked on top of one another, and are separated using non-conducting elastomer sheets. Signal transfer (electrical and fluidic) between these dice is achieved using flexible Parylene cables that are formed on the inside walls of the cube. Conductors and contact pads formed on the Parylene cables are pressed onto matching contact pads on the individual substrates thus forming a mechanical connect/disconnect system for both electrical and fluidic signals. A process for forming the cables and for assembling the entire microsystem has been developed and demonstration prototypes have been constructed to illustrate the feasibility of this approach.