Semiconductor packaging technology for mobile phones in Japan

Abstract

In semiconductor packaging technology for mobile phones, rapid development in materials, structures, manufacturing methods, and design architecture are making it possible to create phones with higher density, lighter weight, and better performance than ever before. Innovations in polymer materials are largely responsible for such improvements. Future-generation mobile phones are required to keep up with wireless communications on higher-speed transmission. Due to this requirement, the mobile phone industry expects engineers to develop new polymer materials capable of keeping circuitry free from electrical noise even under high-speed operation.