{"title":"Micro dispensing of adhesives and other polymers","authors":"W. Meyer","doi":"10.1109/POLYTR.2001.973252","DOIUrl":null,"url":null,"abstract":"Due to the progress in miniaturization of electronic and optoelectronic devices, new processing methods are needed for micro dispensing of adhesives and other polymers. Applications are found in fields like joining, marking and coating. Here, micro dispensing is defined in volume ranges of 30-500 pl (/spl sim/30-500 ng). Not only small volumes but also precision and flexibility are in high demand. For a certain range of adhesives and other polymers used especially in optoelectronic devices, microdrop provides equipment for microdispensing. The basic technique is a spin-off from inkjet-technology and profits from the flexibility and precision of this technology due to the contactless drop ejection. Also, extremely aggressive organic solvents do not cause problems for the valve-free dispensers. This makes the microdrop technology very attractive for solved polymers as used for LEP (light emitting polymer) applications. Here, the actual applications and possibilities are illustrated and the current developments for improved processing strategies are described. There are some demands on the properties of such polymers usable for micro dispensing. These are explained and the limitations are discussed.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"216 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2001.973252","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12

Abstract

Due to the progress in miniaturization of electronic and optoelectronic devices, new processing methods are needed for micro dispensing of adhesives and other polymers. Applications are found in fields like joining, marking and coating. Here, micro dispensing is defined in volume ranges of 30-500 pl (/spl sim/30-500 ng). Not only small volumes but also precision and flexibility are in high demand. For a certain range of adhesives and other polymers used especially in optoelectronic devices, microdrop provides equipment for microdispensing. The basic technique is a spin-off from inkjet-technology and profits from the flexibility and precision of this technology due to the contactless drop ejection. Also, extremely aggressive organic solvents do not cause problems for the valve-free dispensers. This makes the microdrop technology very attractive for solved polymers as used for LEP (light emitting polymer) applications. Here, the actual applications and possibilities are illustrated and the current developments for improved processing strategies are described. There are some demands on the properties of such polymers usable for micro dispensing. These are explained and the limitations are discussed.
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粘合剂和其他聚合物的微点胶
随着电子和光电器件小型化的发展,粘合剂和其他聚合物的微点胶需要新的加工方法。应用于连接,标记和涂层等领域。在这里,微分配被定义在30-500 pl (/spl sim/30-500 ng)的体积范围内。不仅体积小,而且精度和灵活性也有很高的要求。对于特定范围的粘合剂和其他聚合物,特别是在光电器件中使用,microdrop提供了微点胶设备。基本技术是从喷墨技术衍生出来的,由于采用了非接触式滴射技术,该技术具有灵活性和精确性。此外,极具腐蚀性的有机溶剂不会对无阀分配器造成问题。这使得微滴技术对于用于LEP(发光聚合物)应用的溶解聚合物非常有吸引力。在这里,说明了实际应用和可能性,并描述了改进处理策略的当前发展。对于用于微点胶的聚合物的性能有一些要求。对这些进行了解释,并讨论了其局限性。
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