J. Nabicht, Jeanne K. Pitz, P. Siniscalchi, C. Betty, Stephen Maggiotto, D. Richardson, S. M. DeSoto, Sucheendran Sridharan, S. Vemulapalli, Kenneth Downs, D. G. Gata, Ali K. Dweik, D. Guidry, Kyle D. Muskoff, Brandon Beckham, Glenn H. Westphal
{"title":"A voice processing and control module for cable telephony applications","authors":"J. Nabicht, Jeanne K. Pitz, P. Siniscalchi, C. Betty, Stephen Maggiotto, D. Richardson, S. M. DeSoto, Sucheendran Sridharan, S. Vemulapalli, Kenneth Downs, D. G. Gata, Ali K. Dweik, D. Guidry, Kyle D. Muskoff, Brandon Beckham, Glenn H. Westphal","doi":"10.1109/CICC.2002.1012826","DOIUrl":null,"url":null,"abstract":"An IF-baseband multi-chip module, fabricated in 3.3V 0.35/spl mu/m mixed-signal and 1.8V 0.18 /spl mu/m digital CMOS provides OQPSK demodulation with carrier recovery, memory and control, voice-companding codecs, and SLIC interfaces (SIs) for a CATV telephony distribution system. The die area of the mixed-signal IC is 84.9mm/sup 2/ and 15.2mm/sup 2/ for the digital IC. The power dissipation is 660mW.","PeriodicalId":209025,"journal":{"name":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2002 Custom Integrated Circuits Conference (Cat. No.02CH37285)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.2002.1012826","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An IF-baseband multi-chip module, fabricated in 3.3V 0.35/spl mu/m mixed-signal and 1.8V 0.18 /spl mu/m digital CMOS provides OQPSK demodulation with carrier recovery, memory and control, voice-companding codecs, and SLIC interfaces (SIs) for a CATV telephony distribution system. The die area of the mixed-signal IC is 84.9mm/sup 2/ and 15.2mm/sup 2/ for the digital IC. The power dissipation is 660mW.
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