Thermal design of the TW-150 passive optical network access unit. II

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012530

M. Tahmaspur, M. Berhe

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引用次数: 3

Abstract

The TW-150 unit is a thermally hardened product designed to operate under harsh ambient conditions ranging from -40 to 75/spl deg/C and altitudes of up to 13,000 ft above sea level. The unit is designed so that the case and junction temperatures of any component should not exceed 85 and 90/spl deg/C, respectively. Further, the case temperature of the optical module is to be limited to 76/spl deg/C under all operating conditions. Extensive thermal analysis was conducted so that the box operates reliably under these conditions with an acceptable mean time between failure. We present comparison of CFD results with experiments for selected cases. We then discuss transient modeling and fan failure analysis, the effects of fan speed and altitude on temperature of components, and comparison of honeycomb vent with perforated plate vent. We then discuss miscellaneous effects such as the effects of fan power, leakage through small gaps in the system, and placement of temperature sensors inside the unit.

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TW-150无源光网络接入单元的热设计。2。

TW-150装置是一种热硬化产品，可在-40至75/spl℃的恶劣环境条件下工作，海拔高度可达13000英尺。该单元的设计使任何组件的外壳和结温分别不应超过85和90/spl度/C。此外，在所有工作条件下，光模块的外壳温度应限制在76/spl℃。进行了广泛的热分析，以便箱体在这些条件下可靠地运行，并具有可接受的平均故障间隔时间。本文给出了选定情况下的CFD计算结果与实验结果的比较。然后讨论了瞬态建模和风扇失效分析，风扇转速和高度对部件温度的影响，以及蜂窝通风口和穿孔板通风口的比较。然后我们讨论各种影响，如风扇功率的影响，通过系统中的小间隙泄漏，以及在单元内放置温度传感器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

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