Mcm-L Technologies: Myths and Experiences in Multiple Product Scenarios

Abstract

MCC has been using laminate-based multichip modules (MCM-L) and advanced printed circuit board (PCB) technologies in a number of technology development efforts. These applications have targeted a spectrum of product profiles, from few chip packages to high performance computer processor modules. Example demonstrations and findings in each of these areas will be discussed. A main focus of the paper will be to review and challenge some general myths surrounding MCMs and MCM-L/PCB. Aspects of interconnect substrate cost, electrical performance, I/O density capability, and compatibility with high chip power input/output levels will be addressed in the context of both present and future MCM-L capabilities.