Y. Tsubomatsu, Y. Yoshidomi, H. Ohhata, T. Yamazaki, N. Fukutomi
{"title":"Transfer laminate circuit process for fine pitch wiring technology","authors":"Y. Tsubomatsu, Y. Yoshidomi, H. Ohhata, T. Yamazaki, N. Fukutomi","doi":"10.1109/ECTC.1994.367581","DOIUrl":null,"url":null,"abstract":"The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367581","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.<>
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