Modeling the impact of the vertical doping profile on FinFET SRAM VT mismatch

D. Burnett, Xusheng Wu, S. Mun, S. Pandey, M. Eller, S. Parihar, S. Samavedam
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Abstract

The basic multi-gate Vt variation model for uniform doping is extended to support a 2-region fin doping methodology that provides good agreement with Vt mismatch measurements as well as useful insights into how the non-uniform fin doping impacts the mismatch. The methodology displays good agreement for both NMOS and PMOS SRAM devices from a FinFET process. The NMOS Vt mismatch as a function of Vt is found to follow the non-uniform doping model while the PMOS Vt mismatch is higher due to both high, non-uniform doping as well as P-metal gate workfunction induced mismatch.
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模拟垂直掺杂对FinFET SRAM VT失配的影响
扩展了均匀掺杂的基本多栅极Vt变化模型,以支持2区域翅片掺杂方法,该方法与Vt失配测量结果非常吻合,并对非均匀翅片掺杂如何影响失配提供了有用的见解。该方法对FinFET工艺的NMOS和PMOS SRAM器件显示出良好的一致性。发现NMOS的Vt失配随Vt的变化遵循非均匀掺杂模型,而PMOS的Vt失配更高,这是由于高的非均匀掺杂和p -金属栅功函数引起的失配。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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