Self-aligned 0.12 /spl mu/m T-gate In/sub .53/Ga/sub .47/As/In/sub .52/Al/sub .48/As HEMT technology utilising a non-annealed ohmic contact strategy

Abstract

An InGaAs/InAlAs based HEMT structure, lattice matched to an InP substrate, is presented in which drive current and transconductance has been optimized through a double-delta doping strategy. Together with an increase in channel carrier density, this allows the use of a non-annealed ohmic contact process. HEMT devices with 120 nm standard and self-aligned T-gates were fabricated using the non-annealed ohmic process. At DC, self-aligned and standard devices exhibited transconductances of up to 1480 and 1100 mS/mm respectively, while both demonstrated current densities in the range 800 mA/mm. At RF, a cutoff frequency f/sub T/ of 190 GHz was extracted for the self-aligned device. The DC characteristics of the standard devices were then calibrated and modelled using a compound semiconductor Monte Carlo device simulator. MC simulations provide insight into transport within the channel and illustrate benefits over a single delta doped structure.