High-frequency short-pulse bias potential as a universal method of ion-beam and plasma treatment of conductive and dielectric materials using vacuum-arc and ablation plasma

A. Ryabchikov, I. Stepanov, D. Sivin, P. Ananin, S. V. Dektyarev
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引用次数: 1

Abstract

The results of investigations of applicability of the method of high-frequency short-pulsed plasma-immersion ion implantation and (or) coating deposition using vacuum-arc and ablation plasma to conductive and dielectric substrates are presented. It is shown that ion implantation with the ion sputtering compensation by coating deposition from plasma and ion-assisted coating deposition can be realized for the metal and dielectric samples through alteration of the negative bias potential within 0-4·103 V, with the pulse repetition rate of (1- 4.4)·105 pps, pulse duration 0.5-2 μs and duty factor of 0.1-0.9. It is experimentally established that at coating deposition from ablation plasma obtained by the influence of the high-intensity ion beam (j = 3·102 A/m2, E = 350 keV, τ = 90 ns) on the target, the micro-arc effects on the substrate surface are observed at a dc bias potential of more than -60 V. The transition to pulses of 0.5 μs duration enabled to increase the bias potential up to -4 kV. The possibility of application of the high-frequency, short-pulse bias potentials for the formation of coatings from vacuum-arc and ablation plasma with high adhesive strength and improved exploitation characteristics is discussed.
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高频短脉冲偏置电位作为离子束和等离子体处理导电和介电材料的通用方法,利用真空电弧和烧蚀等离子体
介绍了高频短脉冲等离子体浸没离子注入和(或)真空电弧和烧蚀等离子体涂层沉积方法在导电和介电基底上的适用性研究结果。结果表明,通过改变负偏置电位在0 ~ 4·103 V范围内,对金属和介质样品进行离子溅射补偿和离子辅助镀膜的离子注入,脉冲重复率为(1 ~ 4.4)·105 pps,脉冲持续时间为0.5 ~ 2 μs,占空因子为0.1 ~ 0.9。实验证明,在高强度离子束(j = 3·102 A/m2, E = 350 keV, τ = 90 ns)作用于靶材的烧蚀等离子体中,在大于-60 V的直流偏置电位下,基底表面出现微弧效应。过渡到持续时间为0.5 μs的脉冲可以将偏置电位提高到-4 kV。讨论了利用高频、短脉冲偏置电位在真空电弧和烧蚀等离子体中形成具有高粘附强度和改善开发特性的涂层的可能性。
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