{"title":"Single-poly bipolar transistor with selective epitaxial silicon and chemo-mechanical polishing","authors":"C. Nguyen, S. Kuehne, S.S. Wong","doi":"10.1109/VLSIT.1992.200645","DOIUrl":null,"url":null,"abstract":"Fabrication of bipolar transistors employing selective epitaxial growth (SEG) and chemo-mechanical polishing (CMP) is demonstrated. The SEG/CMP combination allows for lithography-limited isolation and results in inherently planar surfaces. The pedestal structure made possible by these technologies facilitates reduction of extrinsic base-collector capacitance and reduces the edge leakage common in SEG structures. The pedestals protect the SEG sidewalls from any potential contaminants or oxidation-induced stress during subsequent processing, and hence help eliminate any induced leakage.<<ETX>>","PeriodicalId":404756,"journal":{"name":"1992 Symposium on VLSI Technology Digest of Technical Papers","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 Symposium on VLSI Technology Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1992.200645","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Fabrication of bipolar transistors employing selective epitaxial growth (SEG) and chemo-mechanical polishing (CMP) is demonstrated. The SEG/CMP combination allows for lithography-limited isolation and results in inherently planar surfaces. The pedestal structure made possible by these technologies facilitates reduction of extrinsic base-collector capacitance and reduces the edge leakage common in SEG structures. The pedestals protect the SEG sidewalls from any potential contaminants or oxidation-induced stress during subsequent processing, and hence help eliminate any induced leakage.<>