S. Pellerano, Steven Callender, W. Shin, Yanjie Wang, Somnath Kundu, Abhishek Agrawal, Peter Sagazio, B. Carlton, F. Sheikh, A. Amadjikpe, William J. Lambert, Divya Shree Vemparala, Mark Chakravorti, Satoshi Suzuki, R. Flory, C. Hull
{"title":"9.7 A Scalable 71-to-76GHz 64-Element Phased-Array Transceiver Module with 2×2 Direct-Conversion IC in 22nm FinFET CMOS Technology","authors":"S. Pellerano, Steven Callender, W. Shin, Yanjie Wang, Somnath Kundu, Abhishek Agrawal, Peter Sagazio, B. Carlton, F. Sheikh, A. Amadjikpe, William J. Lambert, Divya Shree Vemparala, Mark Chakravorti, Satoshi Suzuki, R. Flory, C. Hull","doi":"10.1109/ISSCC.2019.8662496","DOIUrl":null,"url":null,"abstract":"Fifth-generation cellular communication standards (5G) target Gb/s data-rates, pushing the industry beyond the sub-6GHz bands. Tens of GHz of spectrum are available in the frequency bands from 30 to 300GHz. To maintain acceptable link budgets with sufficient antenna apertures, arrays are typically required at these frequencies and electrical beam steering is needed to retain spatial coverage. For such complex systems, highly-integrated, low-cost and energy-efficient SoCs are desirable to enable volume deployment. FinFET technologies are an ideal candidate to tackle this challenging integration, given the excellent balance between density and RF/mm-wave performance that has been recently demonstrated [1].","PeriodicalId":265551,"journal":{"name":"2019 IEEE International Solid- State Circuits Conference - (ISSCC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"44","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Solid- State Circuits Conference - (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2019.8662496","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 44
Abstract
Fifth-generation cellular communication standards (5G) target Gb/s data-rates, pushing the industry beyond the sub-6GHz bands. Tens of GHz of spectrum are available in the frequency bands from 30 to 300GHz. To maintain acceptable link budgets with sufficient antenna apertures, arrays are typically required at these frequencies and electrical beam steering is needed to retain spatial coverage. For such complex systems, highly-integrated, low-cost and energy-efficient SoCs are desirable to enable volume deployment. FinFET technologies are an ideal candidate to tackle this challenging integration, given the excellent balance between density and RF/mm-wave performance that has been recently demonstrated [1].
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
