{"title":"Methodology for the thermal characterization of the MQUAD microelectronic package","authors":"B. Guenin, D. Mahulikar","doi":"10.1109/STHERM.1993.225316","DOIUrl":null,"url":null,"abstract":"Experimental and mathematical modeling techniques which were developed to characterize the thermal performance of MQUAD packages are described. The situation characterized is one of natural convection, with the package attached to a test board. The techniques described take advantage of the unique construction of the MQUAD package in order to achieve relative simplicity in their execution. Due to its low internal thermal resistance and efficient thermal coupling to the circuit board, the thermal behavior of the MQUAD package is dominated by the convective heat transfer coefficient and the thermal conductivity of the circuit board.<<ETX>>","PeriodicalId":369022,"journal":{"name":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1993.225316","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11
Abstract
Experimental and mathematical modeling techniques which were developed to characterize the thermal performance of MQUAD packages are described. The situation characterized is one of natural convection, with the package attached to a test board. The techniques described take advantage of the unique construction of the MQUAD package in order to achieve relative simplicity in their execution. Due to its low internal thermal resistance and efficient thermal coupling to the circuit board, the thermal behavior of the MQUAD package is dominated by the convective heat transfer coefficient and the thermal conductivity of the circuit board.<>
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