Efficient design using fuzzy logic based regression models

B. Schaible, Y.C. Lee, H. Xie
{"title":"Efficient design using fuzzy logic based regression models","authors":"B. Schaible, Y.C. Lee, H. Xie","doi":"10.1109/ECTC.1997.606209","DOIUrl":null,"url":null,"abstract":"With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these models, package performance can be estimated and electrical, thermal, and mechanical considerations can be balanced. In this paper, we present a method of quickly investigating new design concepts based on knowledge of previously studied designs and knowledge of the differences between the new and old designs. This approach is useful when the difference between designs is simple and can be accurately modeled with fewer data. The use of less data equates to a savings of time and money. In the case studies presented, we establish two \"base\" models using 40 data each, then we establish two additional models of similar processes using only five and seven data each. Here, the initial (base) design and the design differences are modeled with fuzzy logic based regression models. Such fuzzy logic regression models can be based on numerically or empirically obtained data or physical knowledge of the system to be modeled. Once established, these models have the advantage of offering very fast response times uncharacteristic of experimentation, prototyping, and numerical methods such as finite element, finite difference, or boundary element modeling.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these models, package performance can be estimated and electrical, thermal, and mechanical considerations can be balanced. In this paper, we present a method of quickly investigating new design concepts based on knowledge of previously studied designs and knowledge of the differences between the new and old designs. This approach is useful when the difference between designs is simple and can be accurately modeled with fewer data. The use of less data equates to a savings of time and money. In the case studies presented, we establish two "base" models using 40 data each, then we establish two additional models of similar processes using only five and seven data each. Here, the initial (base) design and the design differences are modeled with fuzzy logic based regression models. Such fuzzy logic regression models can be based on numerically or empirically obtained data or physical knowledge of the system to be modeled. Once established, these models have the advantage of offering very fast response times uncharacteristic of experimentation, prototyping, and numerical methods such as finite element, finite difference, or boundary element modeling.
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利用基于模糊逻辑的回归模型进行高效设计
随着设计周期的不断缩短,对于设计师来说,拥有能够快速有效地为新设计建模的技术是非常重要的。从这些模型中,可以估计封装性能,并可以平衡电气,热学和机械方面的考虑。在本文中,我们提出了一种基于先前研究的设计知识和新旧设计之间差异的知识快速研究新设计概念的方法。当设计之间的差异很简单,并且可以用更少的数据准确地建模时,这种方法很有用。使用更少的数据等于节省了时间和金钱。在案例研究中,我们建立了两个“基础”模型,每个模型使用40个数据,然后我们建立了两个类似过程的附加模型,每个模型只使用5个和7个数据。本文采用基于模糊逻辑的回归模型对初始(基础)设计和设计差异进行建模。这种模糊逻辑回归模型可以基于数值或经验获得的数据或待建模系统的物理知识。一旦建立,这些模型的优点是提供非常快的响应时间,这是实验、原型和数值方法(如有限元、有限差分或边界元素建模)所不具备的。
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