{"title":"Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor","authors":"A. Wymyslowski, A. Gorecka-Drzazga, K. Sareło","doi":"10.1109/EUROSIME.2016.7463305","DOIUrl":null,"url":null,"abstract":"There are more and more sophisticated sensors in microsystem applications, which seem to rivet the engineers' attention. There is an extraordinary variety of sensors types which includes pressure, temperature, acceleration processing, optical, magnetic, chemical etc. In a number of sensors the critical sensing element most often is made of a silicon. The mechanical properties of silicon are outstanding and techniques for shaping it into complex three-dimensional structures are well known and mastered from the technological point of view. Most often MEMS sensor are integral part of any electronic system. The main attention of the current research was MEMS silicon pressure sensor based on an optical detection of a membrane deflection, which can be used for a pressure detection in harsh environment. The goal of the work was to apply a numerical simulation along with an analytical analysis, which were finally followed up and validated by the experimental results in order to define the sensor RSM (Response Surface Models) model, which can be used directly in complex numerical prototyping of electronic systems using, e.g. SPICE/VERILOG type of simulators.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"55 5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2016.7463305","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
There are more and more sophisticated sensors in microsystem applications, which seem to rivet the engineers' attention. There is an extraordinary variety of sensors types which includes pressure, temperature, acceleration processing, optical, magnetic, chemical etc. In a number of sensors the critical sensing element most often is made of a silicon. The mechanical properties of silicon are outstanding and techniques for shaping it into complex three-dimensional structures are well known and mastered from the technological point of view. Most often MEMS sensor are integral part of any electronic system. The main attention of the current research was MEMS silicon pressure sensor based on an optical detection of a membrane deflection, which can be used for a pressure detection in harsh environment. The goal of the work was to apply a numerical simulation along with an analytical analysis, which were finally followed up and validated by the experimental results in order to define the sensor RSM (Response Surface Models) model, which can be used directly in complex numerical prototyping of electronic systems using, e.g. SPICE/VERILOG type of simulators.