2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463355
M. Benedikt, F. Holzinger
Virtual engineering becomes more and more relevant for different industries to reduce development efforts in terms of costs and time. Especially for large dynamical systems co-simulation is a promising approach for performing system simulations, where subsystems are modeled as well as simulated via tailored simulation tools in a distributed manner. In contrast to general purpose simulation tools for co-simulations an additional higher-level numerical solver (Master Algorithm) is mandatory, which has to be configured by the user and leads to significant additional application efforts: therefore benefits of modular development are strongly limited. Within this paper the occurring coupling challenge for non-iterative co-simulation is investigated and recently proposed solutions are reviewed. On this basis, the necessary information for configuration is identified and an approach for fully automated configuration of non-iterative co-simulations is derived. The proposed concepts are examined.
{"title":"Automated configuration for non-iterative co-simulation","authors":"M. Benedikt, F. Holzinger","doi":"10.1109/EUROSIME.2016.7463355","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463355","url":null,"abstract":"Virtual engineering becomes more and more relevant for different industries to reduce development efforts in terms of costs and time. Especially for large dynamical systems co-simulation is a promising approach for performing system simulations, where subsystems are modeled as well as simulated via tailored simulation tools in a distributed manner. In contrast to general purpose simulation tools for co-simulations an additional higher-level numerical solver (Master Algorithm) is mandatory, which has to be configured by the user and leads to significant additional application efforts: therefore benefits of modular development are strongly limited. Within this paper the occurring coupling challenge for non-iterative co-simulation is investigated and recently proposed solutions are reviewed. On this basis, the necessary information for configuration is identified and an approach for fully automated configuration of non-iterative co-simulations is derived. The proposed concepts are examined.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130381744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463382
P. S. Nasirabadi, Masoud Jabbari, J. Hattel
The challenge of developing a reliable electronic product requires huge amounts of resources and knowledge. Temperature and thermal features directly affect the life of electronic products. Furthermore, moisture can be damaging for electronic components. Nowadays, computational fluid dynamics (CFD) analysis has been proven as a useful tool to exploit the detailed and visualized information about the fluid flows; and hence it can be helpful for predicting local climate inside the electronic enclosures. In this study, the temperature and moisture distributions inside an idealized electronic enclosure with some heat producing components are investigated. It is shown how the enclosure material can influence local climate inside the enclosure using transient numerical simulations. The effect of heat transfer coefficient and wall thickness of the enclosure is also investigated. The enclosure material and the heat transfer coefficient of the enclosure with the environment are found to be influential on the mean temperature and relative humidity; however, the significance of their effects are not the same at different levels. Natural convection plays a key role in RH and temperature distribution.
{"title":"Numerical simulation of transient moisture and temperature distribution in polycarbonate and aluminum electronic enclosures","authors":"P. S. Nasirabadi, Masoud Jabbari, J. Hattel","doi":"10.1109/EUROSIME.2016.7463382","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463382","url":null,"abstract":"The challenge of developing a reliable electronic product requires huge amounts of resources and knowledge. Temperature and thermal features directly affect the life of electronic products. Furthermore, moisture can be damaging for electronic components. Nowadays, computational fluid dynamics (CFD) analysis has been proven as a useful tool to exploit the detailed and visualized information about the fluid flows; and hence it can be helpful for predicting local climate inside the electronic enclosures. In this study, the temperature and moisture distributions inside an idealized electronic enclosure with some heat producing components are investigated. It is shown how the enclosure material can influence local climate inside the enclosure using transient numerical simulations. The effect of heat transfer coefficient and wall thickness of the enclosure is also investigated. The enclosure material and the heat transfer coefficient of the enclosure with the environment are found to be influential on the mean temperature and relative humidity; however, the significance of their effects are not the same at different levels. Natural convection plays a key role in RH and temperature distribution.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126764848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463383
Noor Amalina Ramli, T. Arslan, N. Haridas, W. Zhou
This paper presents the design and simulation of a 4-bit digital MEMS varactor with high capacitance ratio. The proposed varactor design consists of four beams over a co-planar waveguide (CPW) line. A new truss beam design is proposed in order to reduce the spring constant of conventional solid beam structure which results in pull-in voltage of 24.3V making it suitable for low loss phase shifters and tunable filters. A linear capacitance step is realized by varying the contact area between the CPW line and the beam based on binary weighted bit design. The width and the length of each beam is fixed to 50 μm and 550 μm respectively to ensure similar pull-in voltage for all beams. To improve the reliability of the design in terms of dielectric charging, side pull-down electrode and a new stopper design is introduced. The existence of the stopper would prevent a direct contact between the beams and the pull-down electrode. A high capacitance ratio of 35.7 is achieved through the implementation of a deep trench of 26.35 μm on the silicon substrate which decreases the parasitic and fringing field capacitance. 16 different capacitance states ranging from 95 fF to 3.4 pF are realised. The overall size of the varactor is 740 μm × 603 μm. The CPW line and the beams are made from 2 μm thick aluminium, while 0.25 μm thick silicon nitride is used as the dielectric layer. The mechanical simulation of the design is carried out using Coventorware 2008, while the characterization of the RF performance is conducted using CST Microwave Studio.
{"title":"Design and modelling of a digital MEMS varactor for wireless applications","authors":"Noor Amalina Ramli, T. Arslan, N. Haridas, W. Zhou","doi":"10.1109/EUROSIME.2016.7463383","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463383","url":null,"abstract":"This paper presents the design and simulation of a 4-bit digital MEMS varactor with high capacitance ratio. The proposed varactor design consists of four beams over a co-planar waveguide (CPW) line. A new truss beam design is proposed in order to reduce the spring constant of conventional solid beam structure which results in pull-in voltage of 24.3V making it suitable for low loss phase shifters and tunable filters. A linear capacitance step is realized by varying the contact area between the CPW line and the beam based on binary weighted bit design. The width and the length of each beam is fixed to 50 μm and 550 μm respectively to ensure similar pull-in voltage for all beams. To improve the reliability of the design in terms of dielectric charging, side pull-down electrode and a new stopper design is introduced. The existence of the stopper would prevent a direct contact between the beams and the pull-down electrode. A high capacitance ratio of 35.7 is achieved through the implementation of a deep trench of 26.35 μm on the silicon substrate which decreases the parasitic and fringing field capacitance. 16 different capacitance states ranging from 95 fF to 3.4 pF are realised. The overall size of the varactor is 740 μm × 603 μm. The CPW line and the beams are made from 2 μm thick aluminium, while 0.25 μm thick silicon nitride is used as the dielectric layer. The mechanical simulation of the design is carried out using Coventorware 2008, while the characterization of the RF performance is conducted using CST Microwave Studio.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116721106","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463312
Abdalla Youssef, I. Birner, Holger Voelkel, J. Thierauf, Robert Vodiunig, A. Middendorf, K. Lang
Electronic control units (ECUs) in automotive industry are exposed to extreme harsh electrical and physical working conditions. Moreover, due to the continuous innovation in automotive industry, complexity and miniaturization of these systems are increasing. Beside the environmental factors, there are other new requirements facing the electronic components reliability in automotive industry accompanied by `electromobility'. These new requirements represented in charging have increased the operating time of the involved ECUs. In addition to that, Reliability as a definition is the ability of the device to perform its designed function in terms of years of useful lifetime. Furthermore, internal heat dissipation of electronic devices is increased which is caused by increased power densities of electronic devices needed for electromobility requirements. One of the governing factors determining the reliability of electronic control units are first level interconnect technologies; solder joints between electronic components and the printed circuit board. Accelerated testing experiments are used to obtain reliability information by visualizing the possible failure mechanisms during the useful lifetime relatively quick compared to the actual useful lifetime. Systems are subjected to more severe stress levels than those specified in the normal operating conditions. Interfacial structure of solder joints is a main factor determining solder joint reliability. The concerns are not only void formation between the solder and copper substrate, however, formation and growth of inter-metallic compounds (IMCs) is a concern as well. These compounds are brittle materials in nature which could crack and fracture when subjected to mechanical or thermo-mechanical loading leading to possible electrical or overheating failures. A design of experiment has been prepared using industrial electronic modules out of production line with an aim to understand the governing factors determining the reliability of electronic control units under environmental loading conditions. The modules have been stressed in active mode using different designed stress conditions. Failure analysis follows the aging process including functional testing, metallography and microscopy investigations. Evolution of the interfacial structure as well as the mechanical reliability of the solder joints under the different stressing conditions is discussed. Based on the observations obtained from this study, a deep understanding of the aging mechanisms under different environmental stress conditions has been reached. It has been concluded that the solder joint failure mechanisms are more dominant than failure mechanisms of other components. IMCs growth, voiding and cracking in the solder joints under thermal and thermo-mechanical loading is observed which could lead to malfunctioning due to electrical failures or overheating.
{"title":"Reliability analysis of solder joints under different thermal and thermo-mechanical loading conditions: Case study of automotive ECUs","authors":"Abdalla Youssef, I. Birner, Holger Voelkel, J. Thierauf, Robert Vodiunig, A. Middendorf, K. Lang","doi":"10.1109/EUROSIME.2016.7463312","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463312","url":null,"abstract":"Electronic control units (ECUs) in automotive industry are exposed to extreme harsh electrical and physical working conditions. Moreover, due to the continuous innovation in automotive industry, complexity and miniaturization of these systems are increasing. Beside the environmental factors, there are other new requirements facing the electronic components reliability in automotive industry accompanied by `electromobility'. These new requirements represented in charging have increased the operating time of the involved ECUs. In addition to that, Reliability as a definition is the ability of the device to perform its designed function in terms of years of useful lifetime. Furthermore, internal heat dissipation of electronic devices is increased which is caused by increased power densities of electronic devices needed for electromobility requirements. One of the governing factors determining the reliability of electronic control units are first level interconnect technologies; solder joints between electronic components and the printed circuit board. Accelerated testing experiments are used to obtain reliability information by visualizing the possible failure mechanisms during the useful lifetime relatively quick compared to the actual useful lifetime. Systems are subjected to more severe stress levels than those specified in the normal operating conditions. Interfacial structure of solder joints is a main factor determining solder joint reliability. The concerns are not only void formation between the solder and copper substrate, however, formation and growth of inter-metallic compounds (IMCs) is a concern as well. These compounds are brittle materials in nature which could crack and fracture when subjected to mechanical or thermo-mechanical loading leading to possible electrical or overheating failures. A design of experiment has been prepared using industrial electronic modules out of production line with an aim to understand the governing factors determining the reliability of electronic control units under environmental loading conditions. The modules have been stressed in active mode using different designed stress conditions. Failure analysis follows the aging process including functional testing, metallography and microscopy investigations. Evolution of the interfacial structure as well as the mechanical reliability of the solder joints under the different stressing conditions is discussed. Based on the observations obtained from this study, a deep understanding of the aging mechanisms under different environmental stress conditions has been reached. It has been concluded that the solder joint failure mechanisms are more dominant than failure mechanisms of other components. IMCs growth, voiding and cracking in the solder joints under thermal and thermo-mechanical loading is observed which could lead to malfunctioning due to electrical failures or overheating.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129061477","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463346
O. Holck, M. van Dijk, J. Bauer, H. Walter, O. Wittler, K. Lang
In this work we present our results of an approach to assess material property changes with time due to high temperature ageing in an isotropic conductive adhesive. A molecular model of an epoxy with similar primary chemistry is investigated by molecular dynamics simulations. By variation of crosslink density, one supposed effect of ageing (post-curing) is investigated with respect to its impact on diffusivity of water molecules and the free volume of the epoxy matrix. In a simple submodel of a composite material, the portability of the results into FE simulations and their validity are discussed by comparison to experimental results.
{"title":"Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques","authors":"O. Holck, M. van Dijk, J. Bauer, H. Walter, O. Wittler, K. Lang","doi":"10.1109/EUROSIME.2016.7463346","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463346","url":null,"abstract":"In this work we present our results of an approach to assess material property changes with time due to high temperature ageing in an isotropic conductive adhesive. A molecular model of an epoxy with similar primary chemistry is investigated by molecular dynamics simulations. By variation of crosslink density, one supposed effect of ageing (post-curing) is investigated with respect to its impact on diffusivity of water molecules and the free volume of the epoxy matrix. In a simple submodel of a composite material, the portability of the results into FE simulations and their validity are discussed by comparison to experimental results.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127748917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463350
S. Shmulevich, Adne Danny Kassie, D. Elata
We present a new intuitive and rational model of parametric resonance. In parametric resonators one of the system parameters, usually stiffness, is modulated in time. Due to this time modulation the system may develop a periodic response. It is well known that when this modulation is sufficiently strong and at an appropriate frequency, the periodic response may be unbounded - even though the system is not driven directly by an external force. Our model assumes that stiffness is toggled between two distinct values, and that this toggling occurs either when motion is maximal or when velocity is maximal. We show that this model of parametric resonance converges to the classic Meissner parametric resonator, at discrete values of the amplitude and frequency of stiffness modulation. At these critical points the system response is periodic and on the verge of becoming unbounded. The relevance of these critical points is that their discrete nature makes them appealing for sensing and clocking applications in MEMS.
{"title":"A simple excitation model of parametric resonators: Simulating and explaining the response at cross-over points","authors":"S. Shmulevich, Adne Danny Kassie, D. Elata","doi":"10.1109/EUROSIME.2016.7463350","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463350","url":null,"abstract":"We present a new intuitive and rational model of parametric resonance. In parametric resonators one of the system parameters, usually stiffness, is modulated in time. Due to this time modulation the system may develop a periodic response. It is well known that when this modulation is sufficiently strong and at an appropriate frequency, the periodic response may be unbounded - even though the system is not driven directly by an external force. Our model assumes that stiffness is toggled between two distinct values, and that this toggling occurs either when motion is maximal or when velocity is maximal. We show that this model of parametric resonance converges to the classic Meissner parametric resonator, at discrete values of the amplitude and frequency of stiffness modulation. At these critical points the system response is periodic and on the verge of becoming unbounded. The relevance of these critical points is that their discrete nature makes them appealing for sensing and clocking applications in MEMS.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128500277","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463293
Ephraim Suhir
When encountering a particular reliability problem at the design, fabrication, testing, or an operation stage of an electronics product's life, and considering the use of predictive modeling to assess the seriousness and possible consequences of its detected malfunction and likely failure, one has to choose whether a statistical, or a physics-of-failure-based, or a suitable combination of these two major predictive modeling tools should be employed to address the problem and to decide on how to proceed. An effective aerospace-electronics reliability-assurance (AERA) approach is suggested as a possible way to go in such a situation. In this approach the classical statistical Bayes formula (BF) is used at the first step as a technical diagnostics (TD) tool, with an objective to identify, on the probabilistic basis, the faulty (malfunctioning) device(s) from the obtained prognostics-and-health-monitoring (PHM) signals ("symptoms of faults"). The physics-of-failure-based Boltzmann-Arrhenius-Zhurkov's (BAZ) equation, a powerful, flexible and physically meaningful modeling tool suggested about five years ago can be employed at the second step with an objective is to assess the remaining useful life (RUL) of the malfunctioning device(s). If the predicted RUL is still long enough, no action might be needed, but if not, a corrective (restoration) action becomes necessary. It is shown in this connection how short/long the repair time should/could be, so that the availability of the equipment (the probability that it is sound and available to the user when needed) does not fall below the allowable level. In any event, after the first two steps of the AERA modeling effort are carried out, and the assessed probability of the product's continuing operation is found to be satisfactory, the device is put back into operation (testing). If failure nonetheless occurs, the third AERA step should be undertaken to update reliability. A well-known four-parametric statistical beta-distribution (BD), in which the probability of failure is treated as a random variable, can be used at this step. The general AERA concept is illustrated by a detailed numerical example geared to an en-route flight mission. The approach can be used, however, also beyond the aerospace field in other vehicular technologies: maritime, automotive, railroad, etc.
{"title":"Aerospace-electronics reliability-assurance (AERA): Three-step prognostics-and-health-monitoring (PHM) modeling approach","authors":"Ephraim Suhir","doi":"10.1109/EUROSIME.2016.7463293","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463293","url":null,"abstract":"When encountering a particular reliability problem at the design, fabrication, testing, or an operation stage of an electronics product's life, and considering the use of predictive modeling to assess the seriousness and possible consequences of its detected malfunction and likely failure, one has to choose whether a statistical, or a physics-of-failure-based, or a suitable combination of these two major predictive modeling tools should be employed to address the problem and to decide on how to proceed. An effective aerospace-electronics reliability-assurance (AERA) approach is suggested as a possible way to go in such a situation. In this approach the classical statistical Bayes formula (BF) is used at the first step as a technical diagnostics (TD) tool, with an objective to identify, on the probabilistic basis, the faulty (malfunctioning) device(s) from the obtained prognostics-and-health-monitoring (PHM) signals (\"symptoms of faults\"). The physics-of-failure-based Boltzmann-Arrhenius-Zhurkov's (BAZ) equation, a powerful, flexible and physically meaningful modeling tool suggested about five years ago can be employed at the second step with an objective is to assess the remaining useful life (RUL) of the malfunctioning device(s). If the predicted RUL is still long enough, no action might be needed, but if not, a corrective (restoration) action becomes necessary. It is shown in this connection how short/long the repair time should/could be, so that the availability of the equipment (the probability that it is sound and available to the user when needed) does not fall below the allowable level. In any event, after the first two steps of the AERA modeling effort are carried out, and the assessed probability of the product's continuing operation is found to be satisfactory, the device is put back into operation (testing). If failure nonetheless occurs, the third AERA step should be undertaken to update reliability. A well-known four-parametric statistical beta-distribution (BD), in which the probability of failure is treated as a random variable, can be used at this step. The general AERA concept is illustrated by a detailed numerical example geared to an en-route flight mission. The approach can be used, however, also beyond the aerospace field in other vehicular technologies: maritime, automotive, railroad, etc.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117130411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463387
Bo Sun, Xuejun Fan, W. V. van Driel, Guoqi Zhang
In this paper, a systematic approach for reliability assessment of electrolytic capacitor-free LED drivers is developed to investigate the failure rate of MOSFETs in the drivers. An original fly-back driver with electrolytic capacitor and two modified electrolytic capacitor-free drivers are studied, and their performances are compared. Due to LED lumen depreciation during operation, current of the MOSFET decreases over time, which cancels out the effect of junction temperature increase. As a result, the junction temperature of MOSFET increase mildly for the case study, but failure rate is accelerated.
{"title":"A systematic approach for reliability assessment of electrolytic capacitor-free LED drivers","authors":"Bo Sun, Xuejun Fan, W. V. van Driel, Guoqi Zhang","doi":"10.1109/EUROSIME.2016.7463387","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463387","url":null,"abstract":"In this paper, a systematic approach for reliability assessment of electrolytic capacitor-free LED drivers is developed to investigate the failure rate of MOSFETs in the drivers. An original fly-back driver with electrolytic capacitor and two modified electrolytic capacitor-free drivers are studied, and their performances are compared. Due to LED lumen depreciation during operation, current of the MOSFET decreases over time, which cancels out the effect of junction temperature increase. As a result, the junction temperature of MOSFET increase mildly for the case study, but failure rate is accelerated.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125884082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463308
Petra Streit, J. Nestler, A. Shaporin, R. Schulze, T. Gessner
The transient thermal behavior of heating in a Lab-on-a-Chip (LoC) system is important for biological processes that require temperature treatment. A technology platform for LoCs that provides integrated heating functionality has been previously described. For a better understanding of the underlying mechanisms of its thermal dynamics a test system has been set up consisting of a printed circuit board, adhesive tape, integrated heater and microfluidic substrate. The focus of this contribution is the modelling of a transient thermal behavior model of non-integrated and integrated nonlinear heater and its experimental validation. A thermal model of a heating element in a polymer-based system's environment is developed with Finite Element Method. The thermal performance of both, integrated and non-integrated heating elements, is compared. The resulting design considerations are described in detail. Furthermore, the test assembly is investigated experimentally with electrical characterization of the heaters and by infrared camera to verify the simulation results. The thermal model will be the basis for design optimization and the development of a stable control loop in the future.
{"title":"Thermal design of integrated heating for lab-on-a-chip systems","authors":"Petra Streit, J. Nestler, A. Shaporin, R. Schulze, T. Gessner","doi":"10.1109/EUROSIME.2016.7463308","DOIUrl":"https://doi.org/10.1109/EUROSIME.2016.7463308","url":null,"abstract":"The transient thermal behavior of heating in a Lab-on-a-Chip (LoC) system is important for biological processes that require temperature treatment. A technology platform for LoCs that provides integrated heating functionality has been previously described. For a better understanding of the underlying mechanisms of its thermal dynamics a test system has been set up consisting of a printed circuit board, adhesive tape, integrated heater and microfluidic substrate. The focus of this contribution is the modelling of a transient thermal behavior model of non-integrated and integrated nonlinear heater and its experimental validation. A thermal model of a heating element in a polymer-based system's environment is developed with Finite Element Method. The thermal performance of both, integrated and non-integrated heating elements, is compared. The resulting design considerations are described in detail. Furthermore, the test assembly is investigated experimentally with electrical characterization of the heaters and by infrared camera to verify the simulation results. The thermal model will be the basis for design optimization and the development of a stable control loop in the future.","PeriodicalId":438097,"journal":{"name":"2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133806610","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-05-05DOI: 10.1109/EUROSIME.2016.7463302
Shahabeddin Vamegh E., R. Dhaouadi, M. Bakri-Kassem
In this paper, a new electro-thermal dynamic model for V-shaped thermal micro-electromechanical actuators is proposed. The experimental observation of the dynamic voltage-displacement relationship for a thermal micro-actuator shows a complex characteristic indicating the simultaneous presence of electrical/thermal energy storage and mechanical energy dissipation mechanisms. To completely characterize these mechanisms and yet have a simple representation for control, a new electro-thermal model using the lumped elements concept of dynamic systems is developed. This model represents the electrical-thermal energy conversion phenomenon by an equivalent resistive and capacitive circuit leading to a mathematically well-posed linear differential equation. The Lumped-Element (LE) electro-thermal dynamic model accounts for both conduction and convection losses. Experimental results along with numerical simulations with MATLAB and ANSYS are used to verify the accuracy of the proposed modeling approaches.
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