Research on the influence of charge sharing for SEE locations based on 65nm CMOS technology

Zhang Zhun, He Wei, Luo Sheng, Jianmin Cao, Qingyang Wu
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引用次数: 1

Abstract

This paper investigates a heavy ion impacts different locations dependency of charge sharing in 65nm CMOS technology. Three new types structures of charge sharing mechanism (NMOS-NMOS, PMOS-PMOS and NMOS-PMOS) are designed to evaluate the influence of single event effect, and TCAD simulation results reveal that the device sensitive node can collect a large number of charges when the heavy ion impacting location is closer to drain contact for NMOS, and when the location is closer to source contact for PMOS, the PMOS transistor sensitive node can collect much more charges. And the charge sharing will affect the reliability when the ion strikes the center between the two transistors no matter to PMOS or NMOS. The charge sharing influences of three types structures are compared, and it can be a guidance to improve the reliability of devices.
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基于65nm CMOS技术的SEE位置电荷共享影响研究
研究了重离子对65nm CMOS技术中不同位置电荷共享依赖的影响。设计了三种新型电荷共享机制结构(NMOS-NMOS、PMOS-PMOS和NMOS-PMOS)来评估单事件效应的影响,TCAD仿真结果表明,当重离子撞击位置靠近PMOS漏极触点时,器件敏感节点可以收集大量电荷,当重离子撞击位置靠近PMOS源触点时,PMOS晶体管敏感节点可以收集更多电荷。无论是PMOS还是NMOS,当离子撞击到两个晶体管之间的中心时,电荷的分配都会影响可靠性。比较了三种结构对电荷分担的影响,对提高器件的可靠性具有指导意义。
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