Thin film metallization of three-dimensional substrates

Abstract

Metallization of three-dimensional (3D) molded polymer substrates by sputtering technology is an exciting alternative to traditional electroless plating processes. The technology offers the ability to rapidly coat the 3D circuit base without the use of precious metal catalysts or plating baths that may be environmentally harmful. Consequently, sputter coating of 3D circuits offers the advantages of high through-put and flexible manufacturing while minimizing disposable wastes. This paper focuses on the critical issues affecting the performance of sputtered thin film on 3D polymer substrates.<>