The impact of scaled channel length in tunneling field effect transistors (TFETs)

Nurul Huda Abdul Rahman, M. Arshad, N. Othman, M. Fathil, M. S. Nur Humaira, U. Hashim
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Abstract

In this paper, we investigate the channel length (LCH) of the silicon-on-insulator (SOI) n-type tunneling field effect transistor (NTFET) with the respect of device performance. 2D-device simulation was used for simulating the devices with 30 nm gate length of SOI NTFET with 10 nm thin buried oxide (tBOX) and 7 nm thin silicon body (tsi). The device performance, such as threshold voltage (VTH), ON current (ION), OFF current (IOFF), and subthreshold swing (SS) was extracted from the current-voltage characterizations of SOI NTFET. The longer the channel length, the lower the SS value and ION/IOFF ratio obtained in these simulations. Unfortunately, the SS values obtained throughout these simulations were still higher than the typical SS value of TFET device which is supposed to be lower than 60 mV/decade. However, the SS values obtained was still lower compared to the SS value of the MOSFET. On the other hand, ION/IOFF ratio still high which is better for switching operation of the devices.
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隧道场效应晶体管(tfet)中沟道长度的影响
本文研究了绝缘体上硅(SOI) n型隧道场效应晶体管(NTFET)的沟道长度(LCH)与器件性能的关系。采用二维器件仿真的方法,对栅极长度为30 nm、10 nm薄埋氧化物(tBOX)和7 nm薄硅体(tsi)的SOI NTFET器件进行了模拟。从SOI NTFET的电流-电压特性中提取器件性能,如阈值电压(VTH)、开通电流(ION)、关断电流(IOFF)和亚阈值摆幅(SS)。通道长度越长,得到的SS值和ION/IOFF比越低。不幸的是,通过这些模拟获得的SS值仍然高于TFET器件的典型SS值,该值应该低于60 mV/ 10年。然而,与MOSFET的SS值相比,获得的SS值仍然较低。另一方面,离子/ off比仍然很高,有利于器件的开关操作。
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